MMBTA06LT1G onsemi TRANS NPN 80V 0.5A SOT23

label:
2024/02/27 280



• S and NSV Prefix for Automotive and Other Applications RequiringUnique Site and Control Change Requirements; AEC−Q101Qualified and PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHSCompliant


CATALOG
MMBTA06LT1G COUNTRY OF ORIGIN
MMBTA06LT1G PARAMETRIC INFO
MMBTA06LT1G PACKAGE INFO
MMBTA06LT1G MANUFACTURING INFO
MMBTA06LT1G PACKAGING INFO
MMBTA06LT1G ECAD MODELS


COUNTRY OF ORIGIN
China


PARAMETRIC INFO
Type NPN
Configuration Single
Maximum Collector-Emitter Voltage (V) 80
Maximum Collector Base Voltage (V) 80
Maximum Emitter Base Voltage (V) 4
Maximum DC Collector Current (A) 0.5
Material Si
Maximum Power Dissipation (mW) 300
Maximum Junction Ambient Thermal Resistance 556°C/W
Operating Junction Temperature (°C) -55 to 150
Maximum Collector Cut-Off Current (nA) 100
Maximum Collector-Emitter Saturation Voltage (V) 0.25@10mA@100mA
Category Bipolar Small Signal
Minimum DC Current Gain 100@10mA@1V|100@100mA@1V
Number of Elements per Chip 1
Maximum Transition Frequency (MHz) 100(Min)
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 150
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 150


PACKAGE INFO
Supplier Package SOT-23
Basic Package Type Lead-Frame SMT
Pin Count 3
Lead Shape Gull-wing
PCB 3
Tab N/R
Pin Pitch (mm) 0.95
Package Length (mm) 2.9
Package Width (mm) 1.3
Package Height (mm) 0.94
Package Diameter (mm) N/R
Package Overall Length (mm) 2.9
Package Overall Width (mm) 2.4
Package Overall Height (mm) 1
Seated Plane Height (mm) 1
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline Transistor
Package Family Name SOT
Jedec TO-236AB
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard N/A
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material CuFeNi
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Suffix T1
Packaging Tape and Reel
Quantity Of Packaging 3000
Reel Diameter (in) 7
Reel Width (mm) 8.4(Min)
Tape Pitch (mm) 4
Tape Width (mm) 8
Feed Hole Pitch (mm) 4
Hole Center to Component Center (mm) 2
Component Orientation Single Pin At Sprocket Hole
Packaging Document Link to Datasheet
Tape Type Embossed


ECAD MODELS


Продукт RFQ