MPX5700AP NXP Semiconductors IC PRESSURE SENSOR ABS 6-SIP

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2024/08/1 230
MPX5700AP NXP Semiconductors IC PRESSURE SENSOR ABS 6-SIP


• 2.5% Maximum Error over 0 to 85C
• Ideally Suited for Microprocessor or Microcontroller-Based Systems
• Available in Absolute, Differential and Gauge Configurations
• Patented Silicon Shear Stress Strain Gauge
• Durable Epoxy Unibody Element


CATALOG
MPX5700AP COUNTRY OF ORIGIN
MPX5700AP PARAMETRIC INFO
MPX5700AP PACKAGE INFO
MPX5700AP MANUFACTURING INFO
MPX5700AP PACKAGING INFO


COUNTRY OF ORIGIN
Korea (Republic of)


PARAMETRIC INFO
Device Pressure Type Absolute
Equivalent Overload Pressure Range (psi) 100 to 500
Maximum Operating Supply Voltage (V) 5.25
Maximum Operating Temperature (°C) 125
Maximum Overload Pressure 2800kPa
Maximum Storage Temperature (°C) 125
Maximum Supply Current (mA) 10
Minimum Operating Supply Voltage (V) 4.75
Minimum Operating Temperature (°C) -40
Output Type Analog
Linearity Yes
Minimum Storage Temperature (°C) -40
Operating Pressure Range 15kPa to 700kPa
Output Voltage (V) 0.2 to 4.7
Response Time (ms) 1
Media Air
Typical Full Scale Output 4.7VDC
Typical Operating Supply Voltage (V) 5
Accuracy (%) ±2.5(Max)
Operating Supply Voltage (V) 5


PACKAGE INFO
Supplier Package Case 867B-04
Pin Count 6
PCB 6
Tab N/R
Package Length (mm) 29.85(Max)
Package Width (mm) 8.26(Max)
Package Height (mm) 29.34(Max)
Package Diameter (mm) N/R
Mounting Through Hole
Package Material Plastic
Jedec N/A
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL N/R
Maximum Reflow Temperature (°C) N/A
Reflow Solder Time (Sec) N/A
Number of Reflow Cycle 3
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/A
Wave Solder Time (Sec) N/A
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Tray
Quantity Of Packaging 100
Packaging Document Link to Datasheet

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