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• 2.5% Maximum Error over 0 to 85C
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• Ideally Suited for Microprocessor or Microcontroller-Based Systems
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• Available in Absolute, Differential and Gauge Configurations
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• Patented Silicon Shear Stress Strain Gauge
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• Durable Epoxy Unibody Element
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CATALOG |
MPX5700AP COUNTRY OF ORIGIN
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MPX5700AP PARAMETRIC INFO
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MPX5700AP PACKAGE INFO
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MPX5700AP MANUFACTURING INFO
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MPX5700AP PACKAGING INFO
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COUNTRY OF ORIGIN
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Korea (Republic of)
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PARAMETRIC INFO
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Device Pressure Type |
Absolute |
Equivalent Overload Pressure Range (psi) |
100 to 500 |
Maximum Operating Supply Voltage (V) |
5.25 |
Maximum Operating Temperature (°C) |
125 |
Maximum Overload Pressure |
2800kPa |
Maximum Storage Temperature (°C) |
125 |
Maximum Supply Current (mA) |
10 |
Minimum Operating Supply Voltage (V) |
4.75 |
Minimum Operating Temperature (°C) |
-40 |
Output Type |
Analog |
Linearity |
Yes |
Minimum Storage Temperature (°C) |
-40 |
Operating Pressure Range |
15kPa to 700kPa |
Output Voltage (V) |
0.2 to 4.7 |
Response Time (ms) |
1 |
Media |
Air |
Typical Full Scale Output |
4.7VDC |
Typical Operating Supply Voltage (V) |
5 |
Accuracy (%) |
±2.5(Max) |
Operating Supply Voltage (V) |
5 |
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PACKAGE INFO
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Supplier Package |
Case 867B-04 |
Pin Count |
6 |
PCB |
6 |
Tab |
N/R |
Package Length (mm) |
29.85(Max) |
Package Width (mm) |
8.26(Max) |
Package Height (mm) |
29.34(Max) |
Package Diameter (mm) |
N/R |
Mounting |
Through Hole |
Package Material |
Plastic |
Jedec |
N/A |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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MSL |
N/R |
Maximum Reflow Temperature (°C) |
N/A |
Reflow Solder Time (Sec) |
N/A |
Number of Reflow Cycle |
3 |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/A |
Wave Solder Time (Sec) |
N/A |
Wave Temp. Source |
Link to Datasheet |
Lead Finish(Plating) |
Au |
Under Plating Material |
Pd over Ni |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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Packaging |
Tray |
Quantity Of Packaging |
100 |
Packaging Document |
Link to Datasheet |
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