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• Temperature Compensated Over 0 to 85C
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• Ideally Suited for Microprocessor or Microcontroller-Based Systems
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• Patented Silicon Shear Stress Strain Gauge
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• Durable Epoxy Unibody Element
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• No loop compensation required
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| CATALOG |
MPX5999D COUNTRY OF ORIGIN
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MPX5999D PARAMETRIC INFO
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MPX5999D PACKAGE INFO
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MPX5999D MANUFACTURING INFO
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MPX5999D PACKAGING INFO
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COUNTRY OF ORIGIN
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Korea (Republic of)
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PARAMETRIC INFO
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| Device Pressure Type |
Differential |
| Equivalent Overload Pressure Range (psi) |
500 to 1500 |
| Maximum Operating Supply Voltage (V) |
5.25 |
| Maximum Operating Temperature (°C) |
125 |
| Maximum Overload Pressure |
4000kPa |
| Maximum Supply Current (mA) |
10 |
| Minimum Operating Supply Voltage (V) |
4.75 |
| Minimum Operating Temperature (°C) |
-40 |
| Operating Pressure Range |
0kPa to 1000kPa |
| Output Voltage (V) |
0.2 to 4.7 |
| Media |
Air |
| Typical Full Scale Output |
4.7VDC |
| Response Time (ms) |
1 |
| Typical Operating Supply Voltage (V) |
5 |
| Accuracy (%) |
±2.5 |
| Operating Supply Voltage (V) |
5 |
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PACKAGE INFO
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| Supplier Package |
Case 867-08 |
| Pin Count |
6 |
| PCB |
6 |
| Tab |
N/R |
| Package Length (mm) |
16(Max) |
| Package Width (mm) |
5.59(Max) |
| Package Height (mm) |
16(Max) |
| Package Diameter (mm) |
N/R |
| Mounting |
Through Hole |
| Package Family Name |
Case 867-08 |
| Jedec |
N/A |
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MANUFACTURING INFO
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| MSL |
N/R |
| Maximum Reflow Temperature (°C) |
N/A |
| Reflow Solder Time (Sec) |
N/A |
| Number of Reflow Cycle |
3 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/A |
| Wave Solder Time (Sec) |
N/A |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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| Packaging |
Tray |
| Quantity Of Packaging |
125 |
| Packaging Document |
Link to Datasheet |
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