MRF1518NT1 NXP Semiconductors FET RF 40V 520MHZ PLD-1.5

label:
2023/11/14 289



CATALOG
MRF1518NT1 COUNTRY OF ORIGIN
MRF1518NT1 LIFECYCLE
MRF1518NT1 PARAMETRIC INFO
MRF1518NT1 PACKAGE INFO
MRF1518NT1 MANUFACTURING INFO
MRF1518NT1 PACKAGING INFO


COUNTRY OF ORIGIN
Faroe Islands


LIFECYCLE
Obsolete
Dec 01,2021
PARAMETRIC INFO
Channel Type N
Configuration Single Dual Source
Maximum Drain Source Voltage (V) 40
Maximum Continuous Drain Current (A) 4
Maximum Frequency (MHz) 520
Output Power (W) 8(Typ)
Maximum Power Dissipation (mW) 62500
Typical Output Capacitance @ Vds (pF) 33@12.5V
Typical Reverse Transfer Capacitance @ Vds (pF) 4.5@12.5V
Maximum VSWR 20
Typical Power Gain @ Vds (dB) 11
Typical Drain Efficiency (%) 60
Typical Input Capacitance @ Vds (pF) 66@12.5V
Number of Elements per Chip 1
Process Technology LDMOS
Types of Output Stages Single Ended
Typical Power Gain (dB) 13
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Channel Mode Enhancement
Maximum Gate Source Voltage (V) ±20
Minimum Operating Temperature (°C) -65
Maximum Operating Temperature (°C) 150


PACKAGE INFO
Supplier Package PLD-1.5
Pin Count 4
PCB 4
Tab N/R
Package Length (mm) 6.73(Max)
Package Width (mm) 5.97(Max)
Package Height (mm) 1.83(Max)
Package Diameter (mm) N/R
Mounting Surface Mount
Package Material Plastic
Package Family Name PLD-1.5
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 40
Number of Reflow Cycle 3
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Suffix T1
Packaging Tape and Reel
Quantity Of Packaging 1000
Packaging Document Link to Datasheet


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