MT29F8G08ABACAH4-IT:C Micron IC FLASH 8G PARALLEL 63VFBGA

label:
2024/07/19 293



CATALOG
MT29F8G08ABACAH4-IT:C COUNTRY OF ORIGIN
MT29F8G08ABACAH4-IT:C PARAMETRIC INFO
MT29F8G08ABACAH4-IT:C PACKAGE INFO
MT29F8G08ABACAH4-IT:C MANUFACTURING INFO
MT29F8G08ABACAH4-IT:C PACKAGING INFO


COUNTRY OF ORIGIN
China
Singapore


PARAMETRIC INFO
Density (bit) 8G
Cell Type SLC NAND
Interface Type Parallel
Block Organization Symmetrical
Boot Block No
Timing Type Asynchronous
Architecture Sectored
Maximum Cycle Time (s) 20n(Min)
Typical Operating Supply Voltage (V) 3|3.3
Programmability Yes
I/O Mode Parallel
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Number of Bits per Word (bit) 8
Number of Words 1G
Maximum Operating Current (mA) 35
Sector Size 256Kbyte x 4096
Program Current (mA) 35
Address Bus Width (bit) 31
Minimum Operating Supply Voltage (V) 2.7
Maximum Operating Supply Voltage (V) 3.6
Maximum Erase Time (s) 0.01/Block
Maximum Programming Time (ms) 0.6/Page
Command Compatible No
ECC Support Yes
Erase Suspend/Resume Modes Support No
Simultaneous Read/Write Support No
Support of Common Flash Interface No
Support of Page Mode Yes
Page Size 4Kbyte
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Density in Bits (bit) 8589934592


PACKAGE INFO
Supplier Package VFBGA
Basic Package Type Ball Grid Array
Pin Count 63
Lead Shape Ball
PCB 63
Tab N/R
Pin Pitch (mm) 0.8
Package Length (mm) 11
Package Width (mm) 9
Package Height (mm) 1(Max) - 0.25(Min)
Package Diameter (mm) N/R
Package Overall Length (mm) 11
Package Overall Width (mm) 9
Package Overall Height (mm) 1(Max)
Seated Plane Height (mm) 1(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Very Thin Fine Pitch Ball Grid Array
Package Family Name BGA
Jedec N/A
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL N/A
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard N/A
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) SnAgCu
Under Plating Material N/A
Terminal Base Material N/A
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Tray
Quantity Of Packaging 210

Продукт RFQ