MT48LC2M32B2P-6A IT:J Micron IC DRAM 64M PARALLEL 86TSOP II

label:
2024/06/25 285


CATALOG
MT48LC2M32B2P-6A IT:J COUNTRY OF ORIGIN
MT48LC2M32B2P-6A IT:J PARAMETRIC INFO
MT48LC2M32B2P-6A IT:J PACKAGE INFO
MT48LC2M32B2P-6A IT:J MANUFACTURING INFO
MT48LC2M32B2P-6A IT:J PACKAGING INFO
MT48LC2M32B2P-6A IT:J EACD MODELS



COUNTRY OF ORIGIN
Singapore



PARAMETRIC INFO
Type SDR SDRAM
Density (bit) 64M
Maximum Clock Rate (MHz) 167
Maximum Access Time (ns) 17|7.5|5.4
Number of Bits per Word (bit) 32
Typical Operating Supply Voltage (V) 3.3
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Density in Bits (bit) 67108864
Maximum Operating Current (mA) 120
Organization 2Mx32
Number of Internal Banks 4
Number of Words per Bank 512K
Data Bus Width (bit) 32
Number of I/O Lines (bit) 32
Interface Type LVTTL
Address Bus Width (bit) 13
Minimum Operating Supply Voltage (V) 3
Maximum Operating Supply Voltage (V) 3.6
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 150
Operating Supply Voltage (V) 3.3
Process Technology CMOS



PACKAGE INFO
Supplier Package TSOP-II
Basic Package Type Lead-Frame SMT
Pin Count 86
Lead Shape Gull-wing
PCB 86
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 22.22
Package Width (mm) 10.16
Package Height (mm) 1(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 1.2(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Thin Small Outline Package (Type II)
Package Family Name SO
Package Outline Link to Datasheet



MANUFACTURING INFO
MSL N/A
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Sn
Under Plating Material N/A
Terminal Base Material N/A
Number of Wave Cycles N/R



PACKAGING INFO
Packaging Tray
Quantity Of Packaging 108
Packaging Document Link to Datasheet



ECAD MODELS


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