MX29LV640EBTI-70G Macronix IC FLASH 64M PARALLEL 48TSOP

label:
2025/04/25 0
MX29LV640EBTI-70G Macronix 	IC FLASH 64M PARALLEL 48TSOP


CATALOG
MX29LV640EBTI-70G COUNTRY OF ORIGIN
MX29LV640EBTI-70G PARAMETRIC INFO
MX29LV640EBTI-70G PACKAGE INFO
MX29LV640EBTI-70G MANUFACTURING INFO
MX29LV640EBTI-70G ECAD MODELS


COUNTRY OF ORIGIN
China
Taiwan (Province of China)


PARAMETRIC INFO
Density (bit) 64M
Cell Type NOR
Interface Type Parallel
Block Organization Asymmetrical
Boot Block Yes
Timing Type Asynchronous
Architecture Sectored
Maximum Access Time (ns) 70
Programmability Yes
Typical Operating Supply Voltage (V) 3|3.3
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Number of Bits per Word (bit) 8/16
Number of Words 8M/4M
Location of Boot Block Bottom
Maximum Operating Current (mA) 16
Programming Voltage (V) 2.7 to 3.6
Sector Size 8Kbyte x 8|64Kbyte x 127
OE Access Time (ns) 30
Program Current (mA) 30
Address Width (bit) 22
Number of Banks 4
Minimum Operating Supply Voltage (V) 2.7
Maximum Operating Supply Voltage (V) 3.6
Maximum Erase Time (s) 65/Chip
Maximum Programming Time (ms) 160000/Chip
Command Compatible Yes
ECC Support No
Erase Suspend/Resume Modes Support Yes
Simultaneous Read/Write Support No
Support of Common Flash Interface Yes
Support of Page Mode No
Minimum Endurance (Cycles) 100000(Typ)
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Density in Bits (bit) 67108864
Process Technology 130nm


PACKAGE INFO
Supplier Package TSOP-I
Basic Package Type Lead-Frame SMT
Pin Count 48
Lead Shape Gull-wing
PCB 48
Tab N/R
Package Length (mm) 12
Package Width (mm) 18.4
Package Height (mm) 1
Package Diameter (mm) N/R
Mounting Surface Mount
Package Description Thin Small Outline Package (Type I)
Package Family Name SO
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30 to 40
Number of Reflow Cycle 3
Standard J-STD-020D
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) SnBi
Under Plating Material N/A
Terminal Base Material N/A


ECAD MODELS


Продукт RFQ