|
|
| • Very Low Noise at 39 Vrms without a Bypass Capacitor |
| • High Ripple Rejection of 70 dB at 1 kHz |
| • Low Dropout Voltage of 140 mV (typ) at 30 mA |
| • Tight Load Regulation, typically 6 mV for Iout = 50 mA |
| • Fast Enable Turn−On time of 20 sec
|
| • Logic Level Enable |
| • ESR can vary from a few m to 3 |
| • These are Pb−Free Devices |
|
| CATALOG |
| NCP508SQ18T1G COUNTRY OF ORIGIN |
| NCP508SQ18T1G PARAMETRIC INFO |
| NCP508SQ18T1G PACKAGE INFO |
| NCP508SQ18T1G MANUFACTURING INFO |
| NCP508SQ18T1G PACKAGING INFO |
| NCP508SQ18T1G ECAD MODELS |
| NCP508SQ18T1G APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Malaysia |
|
| PARAMETRIC INFO |
| Type |
LDO |
| Number of Outputs |
1 |
| Maximum Output Current (A) |
0.05(Min) |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Output Type |
Fixed |
| Output Voltage Range (V) |
1.8 to 10 |
| Junction to Ambient |
200°C/W |
| Polarity |
Positive |
| Special Features |
Current Limit|Thermal Shutdown Protection |
| Load Regulation |
40mV |
| Line Regulation |
20mV |
| Maximum Quiescent Current (mA) |
0.001 |
| Maximum Dropout Voltage @ Current (V) |
0.25@30mA|0.3@40mA |
| Minimum Input Voltage (V) |
1.8 |
| Maximum Input Voltage (V) |
7 |
| Output Voltage (V) |
1.8 |
| Typical Quiescent Current (mA) |
0.0001 |
| Typical Dropout Voltage @ Current (V) |
0.14@30mA|0.155@40mA|0.18@50mA |
| Accuracy (%) |
±2 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
150 |
|
| PACKAGE INFO |
| Supplier Package |
SC-88A |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
5 |
| Lead Shape |
Gull-wing |
| PCB |
5 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
2.2(Max) |
| Package Width (mm) |
1.35(Max) |
| Package Height (mm) |
1(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
N/A |
|
| MANUFACTURING INFO |
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020C |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
FeNi Alloy |
|
| PACKAGING INFO |
| Packaging Suffix |
T1 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
|
| ECAD MODELS |
 |
|
| APPLICATIONS |
| • RF Subsystems in Handsets |
| • Noise Sensitive Circuits; VCOs, PLL |
|
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