NCP803SN308T1G onsemi IC MPU RESET MONITOR 3.08V SOT23

label:
2023/10/23 365



• Precision VCC Monitor for 1.5 V, 2.5 V, 3.0 V, 3.3 V, and 5.0 V Supplies
• Precision Monitoring Voltages from 1.2 V to 4.9 V Available in 100 mV Steps
• Four Guaranteed Minimum Power−On Reset Pulse Width Available (1 ms, 20 ms, 100 ms, and 140 ms)
• RESET Output Guaranteed to VCC = 1.0 V
• Low Supply Current
• VCC Transient Immunity


CATALOG
NCP803SN308T1G COUNTRY OF ORIGIN
NCP803SN308T1G PARAMETRIC INFO
NCP803SN308T1G PACKAGE INFO
NCP803SN308T1G MANUFACTURING INFO
NCP803SN308T1G PACKAGING INFO
NCP803SN308T1G ECAD MODELS
NCP803SN308T1G APPLICATIONS


COUNTRY OF ORIGIN
Malaysia
United States of America


PARAMETRIC INFO
Output Driver Active Low/Open Drain
Manual Reset No
Watchdog Timer No
Number of Supervisors 1
Typical Reset Threshold Voltage (V) 3.08
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 105
Chip Enable Signals No
Power Fail Detection No
Battery Backup Switching No
Maximum Reset Active Time (ms) 460
Maximum Operating Supply Voltage (V) 5.5
Minimum Reset Threshold Voltage (V) 3.04
Maximum Reset Threshold Voltage (V) 3.11
Monitored Voltage (V) 1.2 to 4.9
Maximum Supply Current (uA) 0.8(Typ)
Minimum Operating Supply Voltage (V) 1.2
Type Voltage Monitor


PACKAGE INFO
Supplier Package SOT-23
Basic Package Type Lead-Frame SMT
Pin Count 3
Lead Shape Gull-wing
PCB 3
Tab N/R
Pin Pitch (mm) 0.95
Package Length (mm) 2.9
Package Width (mm) 1.3
Package Height (mm) 0.94
Package Diameter (mm) N/R
Package Overall Length (mm) 2.9
Package Overall Width (mm) 2.4
Package Overall Height (mm) 1
Seated Plane Height (mm) 1
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline Transistor
Package Family Name SOT
Jedec TO-236AB
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 20 to 40
Number of Reflow Cycle 3
Standard J-STD-020C
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material CuFeAgZn


PACKAGING INFO
Packaging Suffix T1
Packaging Tape and Reel
Quantity Of Packaging 3000
Packaging Document Link to Datasheet


ECAD MODELS



APPLICATIONS
• Computers
• Embedded Systems
• Battery Powered Equipment
• Critical Microprocessor Power Supply Monitoring
Продукт RFQ