nRF52832-QFAA-R Nordic Semiconductor IC RF TXRX+MCU BLUETOOTH 48QFN

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2024/12/12 124

nRF52832-QFAA-R Nordic Semiconductor IC RF TXRX+MCU BLUETOOTH 48QFN

CATALOG

NRF52832-QFAA-R COUNTRY OF ORIGIN

NRF52832-QFAA-R PARAMETRIC INFO

NRF52832-QFAA-R PACKAGE INFO

NRF52832-QFAA-R MANUFACTURING INFO

NRF52832-QFAA-R PACKAGING INFO

NRF52832-QFAA-R ECAD MODELS

COUNTRY OF ORIGIN

Taiwan (Province of China)

Philippines

PARAMETRIC INFO

Type	Chip
Minimum Operating Frequency (MHz)	2360
Maximum Operating Frequency (MHz)	2500
Maximum Data Rate (Mbps)	2
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	85
Typical Operating Supply Voltage (V)	3
Minimum Operating Supply Voltage (V)	1.7
Maximum Operating Supply Voltage (V)	3.6
Operating Supply Voltage (V)	3
Typical Sensitivity (dBm)	-96
Protocols Supported	Bluetooth v5.3 (BLE)
Interface Type	GPIO/I2C/I2S/PCM/SPI/UART
Maximum Standby Current (A)	50u(Typ)
Minimum Storage Temperature (°C)	-40
Maximum Storage Temperature (°C)	125
Antenna Mounting	External
Processing Unit Type	Microcontroller
Special Features	IoT

Supplier Package	QFN EP
Basic Package Type	Non-Lead-Frame SMT
Pin Count	48
Lead Shape	No Lead
PCB	48
Tab	N/R
Package Length (mm)	6
Package Width (mm)	6
Package Height (mm)	0.83
Package Diameter (mm)	N/R
Mounting	Surface Mount
Package Material	Plastic
Package Description	Quad Flat No Lead Package, Exposed Pad
Package Family Name	QFN
Jedec	N/A
Package Outline	Link to Datasheet

MANUFACTURING INFO

MSL	2
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	30
Number of Reflow Cycle	3
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	N/A
Under Plating Material	N/A
Terminal Base Material	N/A
Number of Wave Cycles	N/R

Packaging Suffix	R
Packaging	Tape and Reel
Quantity Of Packaging	3000(Min)
Packaging Document	Link to Datasheet