PCA9617ADP NXP Semiconductors LEVEL TRANSLATING FM+ I2C-BUS

label:
2024/12/24 122
PCA9617ADP NXP Semiconductors  LEVEL TRANSLATING FM+ I2C-BUS


CATALOG
PCA9617ADP COUNTRY OF ORIGIN
PCA9617ADP PARAMETRIC INFO
PCA9617ADP PACKAGE INFO
PCA9617ADP MANUFACTURING INFO
PCA9617ADP PACKAGING INFO


COUNTRY OF ORIGIN
China
Thailand


PARAMETRIC INFO
Maximum Operating Supply Voltage (V) 5.5
Minimum Operating Supply Voltage (V) 2.2
Typical Operating Supply Voltage (V) 3.3|5
Maximum Supply Current (mA) 2.9
Type Repeater
Input Signal Type I2C
Maximum Propagation Delay Time (tPLH) (ns) 130
Maximum Propagation Delay Time (tPHL) (ns) 173
Typical Input Capacitance (pF) 6
Maximum Power Dissipation (mW) 100
Maximum Clock Frequency (kHz) 1000
Maximum Operating Temperature (°C) 85
Minimum Operating Temperature (°C) -40
Minimum Storage Temperature (°C) -55
Temperature Flag Opr
Process Technology CMOS
Maximum Storage Temperature (°C) 125


PACKAGE INFO
Supplier Package TSSOP
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 0.65
Package Length (mm) 3.1(Max)
Package Width (mm) 3.1(Max)
Package Height (mm) 0.95(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 1.1(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Thin Shrink Small Outline Package
Package Family Name SO
Jedec N/A
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Document Link to Datasheet

Продукт RFQ