PMV120ENEAR Nexperia MOSFET N-CH 60V 2.1A TO236AB

label:
2024/10/28 132
PMV120ENEAR Nexperia  MOSFET N-CH 60V 2.1A TO236AB


• Logic level compatible
• Very fast switching
• Trench MOSFET technology
• ElectroStatic Discharge (ESD) protection > 2 kV HBM
• AEC-Q101 qualified


CATALOG
PMV120ENEAR COUNTRY OF ORIGIN
PMV120ENEAR PARAMETRIC INFO
PMV120ENEAR PACKAGE INFO
PMV120ENEAR MANUFACTURING INFO
PMV120ENEAR PACKAGING INFO
PMV120ENEAR APPLICATIONS


COUNTRY OF ORIGIN
China
Taiwan (Province of China)


PARAMETRIC INFO
Channel Type N
Channel Mode Enhancement
Configuration Single
Maximum Drain Source Voltage (V) 60
Maximum Absolute Continuous Drain Current (A) 2.1
Maximum Continuous Drain Current (A) 2.1
Maximum Gate Source Voltage (V) 20
Maximum Drain Source Resistance (mOhm) 123@10V
Typical Gate Charge @ Vgs (nC) 5.9@10V
Typical Gate Charge @ 10V (nC) 5.9
Maximum Power Dissipation (mW) 1050
Process Technology TMOS
Category Small Signal
Typical Input Capacitance @ Vds (pF) 275@30V
Typical Turn-On Delay Time (ns) 6.4
Typical Turn-Off Delay Time (ns) 15.9
Typical Fall Time (ns) 6.3
Typical Rise Time (ns) 8.9
Maximum Gate Source Leakage Current (nA) 10000
Maximum Gate Threshold Voltage (V) 2.7
Maximum IDSS (uA) 1
Number of Elements per Chip 1
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 150
Supplier Temperature Grade Automotive


PACKAGE INFO
Supplier Package SOT-23
Basic Package Type Lead-Frame SMT
Pin Count 3
Lead Shape Gull-wing
PCB 3
Tab N/R
Pin Pitch (mm) 0.95
Package Length (mm) 3(Max)
Package Width (mm) 1.4(Max)
Package Height (mm) 1(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 3(Max)
Package Overall Width (mm) 2.5(Max)
Package Overall Height (mm) 1.1(Max)
Seated Plane Height (mm) 1.1(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline Transistor
Package Family Name SOT
Jedec TO-236AB
Package Outline Link to Datasheet
Maximum PACKAGE_DIMENSION_H 1
Minimum PACKAGE_DIMENSION_H N/A
Maximum PACKAGE_DIMENSION_L 3
Minimum PACKAGE_DIMENSION_L 2.8
Maximum PACKAGE_DIMENSION_W 1.4
Minimum PACKAGE_DIMENSION_W 1.2
Maximum Diameter N/R
Minimum Diameter N/R
Maximum Seated_Plane_Height 1.1
Minimum Seated_Plane_Height 0.9


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard N/A
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) 260
Wave Solder Time (Sec) 10
Lead Finish(Plating) Sn
Under Plating Material Ag
Terminal Base Material Cu Alloy
Number of Wave Cycles 1


PACKAGING INFO
Packaging Suffix R
Packaging Tape and Reel


APPLICATIONS
• Relay driver
• High-speed line driver
• Low-side loadswitch
• Switching circuits
Продукт RFQ