QCN-27+ Mini-Circuits RF PWR DVDR 1.7GHZ-2.7GHZ 6SMD

label:
2025/04/23 31
QCN-27+ Mini-Circuits 	RF PWR DVDR 1.7GHZ-2.7GHZ 6SMD


• Low insertion loss, 0.4 dB typ.
• High isolation, 26 dB typ.
• Wrap-around terminal for excellent solderability
• Ultra small, 0.12"x0.06"x0.035"


CATALOG
QCN-27+ COUNTRY OF ORIGIN
QCN-27+ PARAMETRIC INFO
QCN-27+ PACKAGE INFO
QCN-27+ MANUFACTURING INFO
QCN-27+ PACKAGING INFO
QCN-27+ APPLICATIONS


COUNTRY OF ORIGIN
Taiwan (Province of China)


PARAMETRIC INFO
Module/IC Classification IC
Number of Inputs 1
Number of Outputs 2
Frequency Range (MHz) 1700 to 2700
Minimum Operating Temperature (°C) -55
Number of Ports 2
Maximum Power Rating (W) 15
Minimum Isolation (dB) 18
Maximum Operating Temperature (°C) 100
Input Signal Type Single-Ended
Output Signal Type Single-Ended
Maximum Input Power 15W
Typical Insertion Loss (dB) 0.5
Typical Input VSWR 1.2
Typical Output VSWR 1.2
Output Impedance (Ohm) 50
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 100
Category Passive
Type Combiner/Splitter


PACKAGE INFO
Supplier Package Case FV1206-1
Basic Package Type Non-Lead-Frame SMT
Pin Count 6
Lead Shape No Lead
PCB 6
Tab N/R
Pin Pitch (mm) 0.99
Package Length (mm) 3.2
Package Width (mm) 1.6
Package Height (mm) 0.89
Package Diameter (mm) N/R
Seated Plane Height (mm) 0.89
Mounting Surface Mount
Package Weight (g) 0.02
Package Material Ceramic
Package Description N/A
Package Family Name N/A
Jedec N/A
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 245 to 250
Reflow Solder Time (Sec) N/A
Number of Reflow Cycle 3
Standard J-STD-020
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn
Under Plating Material Ni
Terminal Base Material Ag
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Tape and Reel
Quantity Of Packaging 3000
Reel Diameter (in) 7
Tape Pitch (mm) 4
Tape Width (mm) 8
Component Orientation Index At Sprocket Hole
Packaging Document Link to Datasheet


APPLICATIONS
• Balanced amplifiers
• Modulators
• PCS/DCS
• MMDS
• ISM  
Продукт RFQ