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• Low insertion loss, 0.4 dB typ.
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• High isolation, 26 dB typ.
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• Wrap-around terminal for excellent solderability
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• Ultra small, 0.12"x0.06"x0.035"
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CATALOG |
QCN-27+ COUNTRY OF ORIGIN
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QCN-27+ PARAMETRIC INFO
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QCN-27+ PACKAGE INFO
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QCN-27+ MANUFACTURING INFO
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QCN-27+ PACKAGING INFO
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QCN-27+ APPLICATIONS
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COUNTRY OF ORIGIN
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Taiwan (Province of China)
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PARAMETRIC INFO
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Module/IC Classification |
IC |
Number of Inputs |
1 |
Number of Outputs |
2 |
Frequency Range (MHz) |
1700 to 2700 |
Minimum Operating Temperature (°C) |
-55 |
Number of Ports |
2 |
Maximum Power Rating (W) |
15 |
Minimum Isolation (dB) |
18 |
Maximum Operating Temperature (°C) |
100 |
Input Signal Type |
Single-Ended |
Output Signal Type |
Single-Ended |
Maximum Input Power |
15W |
Typical Insertion Loss (dB) |
0.5 |
Typical Input VSWR |
1.2 |
Typical Output VSWR |
1.2 |
Output Impedance (Ohm) |
50 |
Minimum Storage Temperature (°C) |
-55 |
Maximum Storage Temperature (°C) |
100 |
Category |
Passive |
Type |
Combiner/Splitter |
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PACKAGE INFO
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Supplier Package |
Case FV1206-1 |
Basic Package Type |
Non-Lead-Frame SMT |
Pin Count |
6 |
Lead Shape |
No Lead |
PCB |
6 |
Tab |
N/R |
Pin Pitch (mm) |
0.99 |
Package Length (mm) |
3.2 |
Package Width (mm) |
1.6 |
Package Height (mm) |
0.89 |
Package Diameter (mm) |
N/R |
Seated Plane Height (mm) |
0.89 |
Mounting |
Surface Mount |
Package Weight (g) |
0.02 |
Package Material |
Ceramic |
Package Description |
N/A |
Package Family Name |
N/A |
Jedec |
N/A |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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MSL |
1 |
Maximum Reflow Temperature (°C) |
245 to 250 |
Reflow Solder Time (Sec) |
N/A |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020 |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Wave Temp. Source |
Link to Datasheet |
Lead Finish(Plating) |
Matte Sn |
Under Plating Material |
Ni |
Terminal Base Material |
Ag |
Number of Wave Cycles |
N/R |
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PACKAGING INFO
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Packaging |
Tape and Reel |
Quantity Of Packaging |
3000 |
Reel Diameter (in) |
7 |
Tape Pitch (mm) |
4 |
Tape Width (mm) |
8 |
Component Orientation |
Index At Sprocket Hole |
Packaging Document |
Link to Datasheet |
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APPLICATIONS
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• Balanced amplifiers
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• Modulators
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• PCS/DCS
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• MMDS
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• ISM |
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