S25FL128SAGMFIR01 Infineon Technologies IC FLASH 128M SPI 133MHZ 16SOIC

label:
2024/01/19 439


 
• CMOS 3.0 V core with versatile I/O
• SPI with multi-I/O
   - SPI clock polarity and phase modes 0 and 3
   - DDR option - Extended addressing: 24- or 32-bit address options
   - Serial command set and footprint compatible with S25FL-A, S25FL-K, and S25FL-P SPI families
   - Multi I/O command set and footprint compatible with S25FL-P SPI family
• READ commands
   - Normal, Fast, Dual, Quad, Fast DDR, Dual DDR, Quad DDR
   - AutoBoot - Power up or reset and execute a Normal or Quad read command automatically at a preselected address
   - Common flash interface (CFI) data for configuration information
• Programming (1.5 MBps)
   - 256- or 512-byte page programming buffer options
   - Quad-input page programming (QPP) for slow clock systems
   - Automatic ECC-internal hardware error correction code generation with single bit error correction
• Erase (0.5 to 0.65 MBps)
   - Hybrid sector size option- Physical set of thirty two 4-KB sectors at top or bottom of address space with all remaining sectors of 64 KB, for compatibility with prior generation S25FL devices.
   - Uniform sector option- always erase 256-KB blocks for software compatibility with higher density and future devices.
• Cycling endurance
   - 100,000 program-erase cycles, minimum
• Data retention
   - 20 year data retention, minimum
• Security features
   - OTP array of 1024 bytes
   - Block protection
      • Status Register bits to control protection against program or erase of a contiguous range of sectors.
      • Hardware and software control options
   - Advanced sector protection (ASP)
      • Individual sector protection controlled by boot code or password
• 65-nm MIRRORBIT™ technology with Eclipse architecture
• 65-nm MIRRORBIT™ technology with Eclipse architecture
• I/O supply voltage: 1.65 V to 3.6 V
   - SO16 and FBGA packages  



CATALOG
S25FL128SAGMFIR01 COUNTRY OF ORIGIN
S25FL128SAGMFIR01 PARAMETRIC INFO
S25FL128SAGMFIR01 PACKAGE INFO
S25FL128SAGMFIR01 MANUFACTURING INFO
S25FL128SAGMFIR01 PACKAGING INFO
S25FL128SAGMFIR01 ECAD MODELS
S25FL128SAGMFIR01 FUNCTIONAL BLOCK DIAGRAM



COUNTRY OF ORIGIN
China
Thailand
Taiwan (Province of China)
United States of America
Philippines



PARAMETRIC INFO
Density (bit) 128M
Cell Type NOR
Interface Type Serial (SPI, Dual SPI, Quad SPI)
Block Organization Symmetrical
Boot Block Yes
Timing Type Synchronous
Architecture Sectored
Maximum Access Time (ns) 14.5
Typical Operating Supply Voltage (V) 3|3.3
Programmability Yes
I/O Mode Serial
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Number of Bits per Word (bit) 1/2/4
Number of Words 128M/64M/32M
Location of Boot Block Bottom|Top
Maximum Operating Current (mA) 100
Programming Voltage (V) 2.7 to 3.6
Maximum Operating Frequency (MHz) 133
Sector Size 64Kbyte x 256
Program Current (mA) 100
Address Bus Width (bit) 32
Minimum Operating Supply Voltage (V) 2.7
Maximum Operating Supply Voltage (V) 3.6
Maximum Erase Time (s) 165/Bulk
Maximum Programming Time (ms) 0.75/Page
Command Compatible Yes
ECC Support Yes
Erase Suspend/Resume Modes Support Yes
Simultaneous Read/Write Support No
Support of Common Flash Interface Yes
Support of Page Mode No
Page Size 256byte|512byte
Minimum Endurance (Cycles) 100000
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Density in Bits (bit) 134217728
Process Technology 65nm, MirrorBit
 


PACKAGE INFO
Supplier Package SOIC W
Basic Package Type Lead-Frame SMT
Pin Count 16
Lead Shape Gull-wing
PCB 16
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 10.3
Package Width (mm) 7.5
Package Height (mm) 2.55(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 2.65(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline IC Wide Body
Package Family Name SO
Jedec MS-013AA
Package Outline Link to Datasheet
 


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material Ag
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R
 


PACKAGING INFO
Packaging Suffix 1
Packaging Tube
Quantity Of Packaging 1
Packaging Document Link to Datasheet
 


ECAD MODELS


FUNCTIONAL BLOCK DIAGRAM

Продукт RFQ