S9S12HY64J0CLL NXP Semiconductors IC MCU 16BIT 64KB FLASH 100LQFP

label:
2024/03/28 341



CATALOG
S9S12HY64J0CLL COUNTRY OF ORIGIN
S9S12HY64J0CLL PARAMETRIC INFO
S9S12HY64J0CLL PACKAGE INFO
S9S12HY64J0CLL MANUFACTURING INFO
S9S12HY64J0CLL PACKAGING INFO


COUNTRY OF ORIGIN
Malaysia
China


PARAMETRIC INFO
Data Bus Width (bit) 16
Series name S12
Device Core HCS12
Instruction Set Architecture CISC
Maximum Clock Rate (MHz) 32
Program Memory Type Flash
Program Memory Size 64KB
RAM Size 4KB
Maximum Expanded Memory Size 256KB
Maximum CPU Frequency (MHz) 32
EEPROM 4KB
Direct Memory Access no
Floating Point Unit no
Bluetooth no
Wi-Fi no
Multiply Accumulate no
Touch Sensing Interface no
Power On Reset yes
Memory Protection Unit no
Temperature Sensor yes
DDR no
Memory Management Unit no
Integrated Development Environment no
Super Scalar no
External Bus Interface no
Data Memory Size 4KB
Number of Programmable I/Os 80
Number of Timers 2
ADC Channels 8
ADC Resolution (bit) 10
Number of ADCs Single
Core Architecture S12
PWM 8
Watchdog 1
LCD Segments 160
Analog Comparators 3
Parallel Master Port no
Real Time Clock no
Special Features LCD Controller
Interface Type CAN/I2C/SCI/SPI
Timers Resolution (bit) 16/16
Programmability yes
SPI 1
I2C 1
I2S 0
UART 0
USART 0
CAN 1
USB 0
Ethernet 0
Minimum Operating Supply Voltage (V) 3.13
Typical Operating Supply Voltage (V) 5
Maximum Operating Supply Voltage (V) 5.5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Operating Supply Voltage (V) 5
Maximum Storage Temperature (°C) 155
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier packaging LQFP
Basic package type Lead-Frame SMT
Number of pins 100
Pin shape Gull-wing
PCB 100
ears N/R
Pin spacing (mm) 0.5
Package length (mm) 14
Package width (mm) 14
Package height (mm) 1.5(Max)
Package diameter (mm) N/R
Package Overall Length (mm) 16
Package Overall Width (mm) 16
Package Overall Height (mm) 1.7(Max)
Mounting surface height (mm) 1.7(Max)
Install Surface Mount
Package weight (g) 0.6852
Packaging materials Plastic
package instruction Low Profile Quad Flat Package
Package series name QFP
JEDEC MS-026BBA
Package outline Link to datasheet


MANUFACTURING INFO
MSL 3
Maximum reflow temperature (°C) 260
Reflow soldering time (seconds) 40
Number of reflow cycles 3
Reflow temperature source Link to datasheet
Maximum wave soldering temperature (°C) N/R
Wave soldering time (seconds) N/R
Lead Finish(Plating) Matte Sn annealed
Plating materials not applicable
Terminal Base Material Cu Alloy


PACKAGING INFO
Package Tray
Packing quantity 450
packaging type file Link to datasheet
 
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