SFH6916 Vishay Semiconductors OPTOISO 3.75KV 4CH TRANS 16-SOP

label:
2024/02/28 265



• SSOP (shrink small outline package)
• Isolation test voltage, 3750 VRMS
• High collector emitter voltage, VCEO = 70 V
• Low saturation voltage
• Fast switching times
• Temperature stable
• Low coupling capacitance
• End stackable, 0.050" (1.27 mm) spacing
• Material categorization: for definitions of complianceplease see


CATALOG
SFH6916 Country of Origin
SFH6916 Parametric Info
SFH6916 Package Info
SFH6916 Manufacturing Info
SFH6916 Packaging Info
SFH6916 ECAD Models


COUNTRY OF ORIGIN
China
Germany
Malaysia


PARAMETRIC INFO
Input Type DC
Output Type DC
Output Device Transistor
Standard BSI|CQC|cUL|FIMKO|IEC|UL
Number of Channels per Chip 4
Typical Forward Voltage (V) 1.15
Maximum Forward Voltage (V) 1.4
Maximum Forward Current (mA) 50
Maximum Collector Current (mA) 100
Maximum Reverse Voltage (V) 6
Maximum Collector-Emitter Voltage (V) 70
Maximum Collector-Emitter Saturation Voltage (mV) 400
Minimum Isolation Voltage (Vrms) 3750
Maximum Power Dissipation (mW) 150
Minimum Current Transfer Ratio (%) 50
Maximum Current Transfer Ratio (%) 300
Current Transfer Ratio Test Current (mA) 5
Typical Rise Time (us) 4
Typical Fall Time (us) 3
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 100
Maximum Storage Temperature (°C) 125
Minimum Storage Temperature (°C) -55


PACKAGE INFO
Supplier Package SOP
Basic Package Type Lead-Frame SMT
Pin Count 16
Lead Shape Gull-wing
PCB 16
Tab N/R
Pin Pitch (mm) 1.4(Max)
Package Length (mm) 11.02(Max)
Package Width (mm) 4.83(Max)
Package Height (mm) 2.03(Max)
Package Diameter (mm) N/R
Mounting Surface Mount
Package Material Plastic
Package Description Plastic Small Outline Package
Package Family Name SO
Jedec N/A


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 10
Number of Reflow Cycle N/A
Standard N/A
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn
Under Plating Material N/A
Terminal Base Material CuFe
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Document Link to Datasheet


ECAD MODELS


Продукт RFQ