SM5S22AHE3/2D Vishay Semiconductors TVS DIODE 22V 35.5V DO218AB

label:

2024/03/25 228

CATALOG

SM5S22AHE3/2D LIFE CYCLE

SM5S22AHE3/2D PARAMETRIC INFO

SM5S22AHE3/2D PACKAGE INFO

SM5S22AHE3/2D MANUFACTURING INFO

SM5S22AHE3/2D PACKAGING INFO

Obsolete Feb 28, 2017

PARAMETRIC INFO

Configuration	Single
Direction Type	Uni-Directional
Maximum Reverse Stand-Off Voltage (V)	twenty two
Minimum Breakdown Voltage (V)	24.4
Maximum Clamping Voltage (V)	35.5
Maximum Reverse Leakage Current (uA)	10
Number of Elements per Chip	1
Maximum Peak Pulse Current (A)	101
Test Current (mA)	5
Operating Junction Temperature (°C)	-55 to 175
Minimum Storage Temperature (°C)	-55
Maximum Storage Temperature (°C)	175
Peak Pulse Power Dissipation (W)	3600
Minimum Operating Temperature (°C)	-55
Maximum Operating Temperature (°C)	175
Supplier Temperature Rating	car

Supplier packaging	DO-218AB
Basic package type	Lead-Frame SMT
Number of pins	2
Pin shape	J-Lead
PCB	1
ears	ears
Pin spacing (mm)	not applicable
Package length (mm)	13.7(Max)
Package width (mm)	8.7(Max)
Package height (mm)	5(Max)-0.4(Min)
Package diameter (mm)	N/R
Package Overall Length (mm)	16(Max)
Package Overall Width (mm)	10.5(Max)
Package Overall Height (mm)	5.5(Max)
Mounting surface height (mm)	5.5(Max)
Install	Surface Mount
Packaging materials	Plastic
package instruction	SMD Plastic Package
Package series name	DO
JEDEC	DO-218AB
Package outline	Link to datasheet

MANUFACTURING INFO

MSL	1
Maximum reflow temperature (°C)	245
Reflow soldering time (seconds)	20 to 40
Reflow temperature source	Link to datasheet
Maximum wave soldering temperature (°C)	N/R
Wave soldering time (seconds)	N/R
Wave soldering temperature source	Link to datasheet
Lead Finish(Plating)	Matt Sn
Plating materials	Ni
Terminal Base Material	Cu

Package

Tape and reel packaging