 |
|
| • Peak pulse power: 600 W (10/1000 μs) and 4 kW (8/20 μs) |
| • Stand-off voltage range from 5 V to 188 V |
| • Unidirectional and bidirectional types |
| • Low leakage current: 0.2 μA at 25 °C and 1 μA at 85 °C |
| • Operating Tj
max: 150 °C
|
| • High power capability at Tj
max.: up to 515 W (10/1000 µs)
|
| • Lead finishing: matte tin plating |
|
| CATALOG |
| SM6T6V8CA COUNTRY OF ORIGIN |
| SM6T6V8CA PARAMETRIC INFO |
| SM6T6V8CA PACKAGE INFO |
| SM6T6V8CA MANUFACTURING INFO |
| SM6T6V8CA PACKAGING INFO |
| SM6T6V8CA ECAD MODELS |
|
| COUNTRY OF ORIGIN |
| United States of America |
| Philippines |
| China |
| Morocco |
|
| PARAMETRIC INFO |
| Configuration |
Single |
| Direction Type |
Bi-Directional |
| Maximum Reverse Stand-Off Voltage (V) |
5.8 |
| Minimum Breakdown Voltage (V) |
6.45 |
| Maximum Clamping Voltage (V) |
10.5 |
| Maximum Reverse Leakage Current (uA) |
20 |
| Number of Elements per Chip |
1 |
| Maximum Peak Pulse Current (A) |
57 |
| Test Current (mA) |
10 |
| Operating Junction Temperature (°C) |
-55 to 150 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Peak Pulse Power Dissipation (W) |
600 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
150 |
| Supplier Temperature Grade |
Industrial |
|
|
| PACKAGE INFO |
| Supplier Package |
SMB |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
2 |
| Lead Shape |
J-Lead |
| PCB |
2 |
| Tab |
N/R |
| Pin Pitch (mm) |
N/R |
| Package Length (mm) |
4.6(Max) |
| Package Width (mm) |
3.95(Max) |
| Package Height (mm) |
2.45(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5.6(Max) |
| Package Overall Width (mm) |
3.95(Max) |
| Package Overall Height (mm) |
2.65(Max) |
| Seated Plane Height (mm) |
2.65(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
0.11 |
| Package Material |
Plastic |
| Package Description |
SMD Plastic Package |
| Package Family Name |
DO-214-AA |
| Jedec |
DO-214AA |
| Package Outline |
Link to Datasheet |
|
|
| MANUFACTURING INFO |
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Number of Reflow Cycle |
3 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
10 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
|
|
| PACKAGING INFO |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1000 |
|
|
| ECAD MODELS |
 |
| |
|
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