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SMF33A LITTELFUSE Transient Voltage Suppression Diodes

label:
2023/08/8 478


• 200W peak pulsepower capability at 10/1000µs waveform, repetition rate (duty cycle): 0.01%
• Compatible with industrial standard package SOD-123FL
• Low profile: maximum height of 1.1mm.
• Low inductance, excellent clamping capability
• For surface mounted applications to optimize board space
CATALOG
SMF33APARAMETRIC INFO
SMF33APACKAGE INFO
SMF33AMANUFACTURING INFO
SMF33APACKAGING INFO

COUNTRY OF ORIGIN
China

PARAMETRIC INFO
Configuration Single
Direction Type Uni-Directional
Maximum Reverse Stand-Off Voltage (V) 33
Minimum Breakdown Voltage (V) 36.7
Maximum Clamping Voltage (V) 53.3
Maximum Reverse Leakage Current (uA) 1
Maximum Breakdown Voltage (V) 40.6
Number of Elements per Chip 1
Maximum Peak Pulse Current (A) 3.8
Test Current (mA) 1
Operating Junction Temperature (°C) -65 to 150
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 175
Maximum Power Dissipation (mW) 1000
Peak Pulse Power Dissipation (W) 200
Minimum Operating Temperature (°C) -65
Maximum Operating Temperature (°C) 150


PACKAGE INFO
Supplier Package SOD-123F
Basic Package Type Lead-Frame SMT
Pin Count 2
Lead Shape Flat
PCB 2
Tab N/R
Pin Pitch (mm) N/R
Package Length (mm) 2.9(Max)
Package Width (mm) 2(Max)
Package Height (mm) 1(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 1.1(Max)
Mounting Surface Mount
Package Material Plastic
Package Description Small Outline Diode Package
Package Family Name SOD
Jedec N/A


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn
Under Plating Material N/A
Terminal Base Material N/A
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Tape and Reel
Quantity Of Packaging 3000

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