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• Meets the Requirements of ISO11898-2
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• I/O Voltage Range Supports 3.3-V and 5-V MCUs
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• Characterized for –40°C to 125°C Operation
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CATALOG |
SN65HVD256DR COUNTRY OF ORIGIN |
SN65HVD256DR PARAMETRIC INFO
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SN65HVD256DR PACKAGE INFO
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SN65HVD256DR MANUFACTURING INFO
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SN65HVD256DR PACKAGING INFO
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SN65HVD256DR ECAD MODELS
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SN65HVD256DR BLOCK DIAGRAM
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SN65HVD256DR APPLICATIONS
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COUNTRY OF ORIGIN
|
Mexico |
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PARAMETRIC INFO
|
Category |
Transceiver |
Maximum Data Rate |
1Mbps |
Standard Supported |
ISO 11898-2 |
Number of Transceivers |
1 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
125 |
Supplier Temperature Grade |
Industrial |
Typical Operating Supply Voltage (V) |
5 |
Minimum Operating Supply Voltage (V) |
4.5 |
Maximum Operating Supply Voltage (V) |
5.5 |
Maximum Supply Current (mA) |
180 |
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PACKAGE INFO
|
Supplier Package |
SOIC |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
8 |
Lead Shape |
Gull-wing |
PCB |
8 |
Tab |
N/R |
Pin Pitch (mm) |
1.27 |
Package Length (mm) |
5(Max) |
Package Width (mm) |
3.98(Max) |
Package Height (mm) |
1.5(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
5(Max) |
Package Overall Width (mm) |
6.19(Max) |
Package Overall Height (mm) |
1.75(Max) |
Seated Plane Height (mm) |
1.75(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Small Outline IC |
Package Family Name |
SO |
Jedec |
MS-012AA |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
|
MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Au |
Under Plating Material |
Pd over Ni |
Terminal Base Material |
Cu Alloy |
Number of Wave Cycles |
N/R |
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PACKAGING INFO
|
Packaging Suffix |
R |
Packaging |
Tape and Reel |
Quantity Of Packaging |
2500 |
Reel Diameter (in) |
13 |
Tape Pitch (mm) |
8 |
Tape Width (mm) |
12 |
Component Orientation |
Q1 |
Packaging Document |
Link to Datasheet |
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ECAD MODELS
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BLOCK DIAGRAM
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APPLICATIONS
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• 1-Mbps Operation in Highly Loaded CAN
Networks Down to 10-kbps Networks Using TXD
DTO
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• Industrial Automation, Control, Sensors, and Drive
Systems
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• Building, Security, and Climate Control
Automation
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• Telecom Base Station Status and Control
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• SN65HVD257: Functional Safety With Redundant
and Multitopology CAN networks
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• CAN Bus Standards Such as CANopen, DeviceNet,NMEA2000,ARNIC825, ISO11783,and CANaerospace
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