SN74AHC125RGYR Texas Instruments SNx4AHC125 Quadruple Bus Buffer Gates With 3-State Outputs

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2024/10/24 153
SN74AHC125RGYR Texas Instruments SNx4AHC125 Quadruple Bus Buffer Gates With 3-State Outputs

• Operating range of 2V to 5.5V
• Latch-up performance exceeds 250mA per JESD 17
• Four individual output enable pins

CATALOG
SN74AHC125RGYR COUNTRY OF ORIGIN
SN74AHC125RGYR PARAMETRIC INFO
SN74AHC125RGYR PACKAGE INFO
SN74AHC125RGYR MANUFACTURING INFO
SN74AHC125RGYR PACKAGING INFO
SN74AHC125RGYR ECAD MODELS
SN74AHC125RGYR APPLICATIONS

COUNTRY OF ORIGIN
Philippines
Thailand
China
Malaysia

PARAMETRIC INFO
Process Technology CMOS
Logic Family AHC
Logic Function Buffer/Line Driver
Input Signal Type Single-Ended
Output Type 3-State
Polarity Non-Inverting
Bus Hold No
Number of Elements per Chip 4
Number of Channels per Chip 4
Number of Output Enables per Chip 4 Low
Number of Input Enables per Chip 0
Number of Inputs per Chip 4
Number of Outputs per Chip 4
Minimum Operating Supply Voltage (V) 2
Maximum Operating Supply Voltage (V) 5.5
Typical Operating Supply Voltage (V) 2.5|3.3|5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Supplier Temperature Grade Commercial
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Maximum Propagation Delay Time @ Maximum CL (ns) 11.5@3.3V|7.5@5V
Absolute Propagation Delay Time (ns) 15
Propagation Delay Test Condition (pF) 50
Maximum High Level Output Current (mA) -8
Maximum Low Level Output Current (mA) 8
Maximum Quiescent Current (uA) 4


PACKAGE INFO
Supplier Package VQFN EP
Basic Package Type Non-Lead-Frame SMT
Pin Count 14
Lead Shape No Lead
PCB 14
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 3.65(Max)
Package Width (mm) 3.65(Max)
Package Height (mm) 0.95(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 3.65(Max)
Package Overall Width (mm) 3.65(Max)
Package Overall Height (mm) 1(Max)
Seated Plane Height (mm) 1(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Very Thin Quad Flat No Lead Package, Exposed Pad
Package Family Name QFN
Jedec MO-241VBA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 2
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Suffix R
Packaging Tape and Reel
Quantity Of Packaging 3000
Reel Diameter (in) 13
Reel Width (mm) 12.4
Tape Pitch (mm) 8
Tape Width (mm) 12
Component Orientation Q1
Packaging Document Link to Datasheet


ECAD MODELS


APPLICATIONS
• Flow Meters
• Programmable Logic Controllers
• Power Over Ethernet (PoE)
• Motor Drives and Controls
• Electronic Point-of-Sale
Продукт RFQ