SP3238EEA-L/TR MaxLinear IC TXRX RS232 INTELLIGENT 28SSOP

label:
2024/10/21 125
SP3238EEA-L/TR MaxLinear IC TXRX RS232 INTELLIGENT 28SSOP


• Meets true EIA/TIA-232-F Standards from a +3.0V to +5.5V power supply
• Interoperable with EIA/TIA-232 and adheres to EIA/TIA-562 down to a +2.7V power source


CATALOG
SP3238EEA-L/TR COUNTRY OF ORIGIN
SP3238EEA-L/TR PARAMETRIC INFO
SP3238EEA-L/TR PACKAGE INFO
SP3238EEA-L/TR MANUFACTURING INFO
SP3238EEA-L/TR PACKAGING INFO
SP3238EEA-L/TR ECAD MODELS


COUNTRY OF ORIGIN
China
Taiwan (Province of China)


PARAMETRIC INFO
Function Line Transceiver
Number of Transceivers 1
Number of Transmitters 5
Number of Receivers 3
Data Transmission Topology Point-to-Point
Transmitter Signal Type Single-Ended
Receiver Signal Type Single-Ended
Transmitter Communication Type RS-232
Charge Pump Yes
Number of External Capacitors 4
External Capacitor Capacitance (uF) 0.1
Power Down Mode Shutdown
Typical Shutdown Current (uA) 1
Channel Operating Mode Full Duplex
Receiver Communication Type RS-232
Input Logic Level TTL|CMOS
Output Logic Level TTL|CMOS
Interface Standards EIA/TIA-232|EIA/TIA-232-F|EIA/TIA-562|RS-232
Number of Transmitter Enables 2
Number of Receiver Enables 0
Number of Drivers per Line 1
Number of Receivers per Line 1
Data Rate 250Kbps(Min)
Driving Mode 3-State
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Extended
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65
Power Supply Type Single
Typical Single Supply Voltage (V) 3.3|5
Minimum Single Supply Voltage (V) 3
Maximum Single Supply Voltage (V) 5.5
Maximum Supply Current (mA) 1


PACKAGE INFO
Supplier Package SSOP
Basic Package Type Lead-Frame SMT
Pin Count 28
Lead Shape Gull-wing
PCB 28
Tab N/R
Pin Pitch (mm) 0.65
Package Length (mm) 10.2
Package Width (mm) 5.3
Package Height (mm) 1.75
Package Diameter (mm) N/R
Package Overall Length (mm) 10.2
Package Overall Width (mm) 7.8
Package Overall Height (mm) 2(Max)
Seated Plane Height (mm) 2(Max)
Mounting Surface Mount
Package Material Plastic
Package Description Shrink Small Outline Package
Package Family Name SO
Jedec MO-150AH
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 2
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Suffix /TR
Packaging Tape and Reel


ECAD MODELS


Продукт RFQ