SPC5606BF1MLQ6 NXP Semiconductors IC MCU 32BIT 1MB FLASH 144LQFP

2024/08/22 225

CATALOG

Malaysia

Taiwan (Province of China)

Family Name	MPC56xx
Data Bus Width (bit)	32
Device Core	e200z0h
Instruction Set Architecture	RISC
Maximum Clock Rate (MHz)	64
Program Memory Type	Flash
Program Memory Size	1MB
RAM Size	80KB
Data Memory Size	64KB
Maximum CPU Frequency (MHz)	64
Number of Programmable I/Os	121
Number of Timers	2
ADC Channels	19/15/19/5
ADC Resolution (bit)	10/10/12/12
Core Architecture	e200
Number of ADCs	Quad
PWM	1
Watchdog	1
Parallel Master Port	No
Real Time Clock	Yes
Special Features	CAN Controller
Interface Type	CAN/I2C/SCI/SPI
Programmability	Yes
SPI	5
I2C	1
Process Technology	90nm
I2S	0
UART	0
USART	0
CAN	6
USB	0
Ethernet	0
Minimum Operating Supply Voltage (V)	3\|4.5
Typical Operating Supply Voltage (V)	3.3\|5
Maximum Operating Supply Voltage (V)	3.6\|5.5
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	125
Temperature Flag	Opr
Supplier Temperature Grade	Automotive
Operating Supply Voltage (V)	3.3\|5
Maximum Storage Temperature (°C)	150
Minimum Storage Temperature (°C)	-55

Supplier Package	LQFP
Basic Package Type	Lead-Frame SMT
Pin Count	144
Lead Shape	Gull-wing
PCB	144
Tab	N/R
Pin Pitch (mm)	0.5
Package Length (mm)	20
Package Width (mm)	20
Package Height (mm)	1.45(Max)
Package Diameter (mm)	N/R
Package Overall Length (mm)	22
Package Overall Width (mm)	22
Package Overall Height (mm)	1.6(Max)
Seated Plane Height (mm)	1.6(Max)
Mounting	Surface Mount
Package Weight (g)	1.3191
Package Material	Plastic
Package Description	Low Profile Quad Flat Package
Package Family Name	QFP
Jedec	MS-026BFB
Package Outline	Link to Datasheet

MSL	3
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	40
Number of Reflow Cycle	3
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	Sn
Under Plating Material	N/A
Terminal Base Material	Cu Alloy