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CATALOG |
SPC5606BF1MLQ6 COUNTRY OF ORIGIN
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SPC5606BF1MLQ6 PARAMETRIC INFO
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SPC5606BF1MLQ6 PACKAGE INFO
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SPC5606BF1MLQ6 MANUFACTURING INFO
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SPC5606BF1MLQ6 PACKAGING INFO
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COUNTRY OF ORIGIN
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Malaysia
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Taiwan (Province of China)
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PARAMETRIC INFO
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Family Name |
MPC56xx |
Data Bus Width (bit) |
32 |
Device Core |
e200z0h |
Instruction Set Architecture |
RISC |
Maximum Clock Rate (MHz) |
64 |
Program Memory Type |
Flash |
Program Memory Size |
1MB |
RAM Size |
80KB |
Data Memory Size |
64KB |
Maximum CPU Frequency (MHz) |
64 |
Number of Programmable I/Os |
121 |
Number of Timers |
2 |
ADC Channels |
19/15/19/5 |
ADC Resolution (bit) |
10/10/12/12 |
Core Architecture |
e200 |
Number of ADCs |
Quad |
PWM |
1 |
Watchdog |
1 |
Parallel Master Port |
No |
Real Time Clock |
Yes |
Special Features |
CAN Controller |
Interface Type |
CAN/I2C/SCI/SPI |
Programmability |
Yes |
SPI |
5 |
I2C |
1 |
Process Technology |
90nm |
I2S |
0 |
UART |
0 |
USART |
0 |
CAN |
6 |
USB |
0 |
Ethernet |
0 |
Minimum Operating Supply Voltage (V) |
3|4.5 |
Typical Operating Supply Voltage (V) |
3.3|5 |
Maximum Operating Supply Voltage (V) |
3.6|5.5 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
125 |
Temperature Flag |
Opr |
Supplier Temperature Grade |
Automotive |
Operating Supply Voltage (V) |
3.3|5 |
Maximum Storage Temperature (°C) |
150 |
Minimum Storage Temperature (°C) |
-55 |
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PACKAGE INFO
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Supplier Package |
LQFP |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
144 |
Lead Shape |
Gull-wing |
PCB |
144 |
Tab |
N/R |
Pin Pitch (mm) |
0.5 |
Package Length (mm) |
20 |
Package Width (mm) |
20 |
Package Height (mm) |
1.45(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
22 |
Package Overall Width (mm) |
22 |
Package Overall Height (mm) |
1.6(Max) |
Seated Plane Height (mm) |
1.6(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
1.3191 |
Package Material |
Plastic |
Package Description |
Low Profile Quad Flat Package |
Package Family Name |
QFP |
Jedec |
MS-026BFB |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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MSL |
3 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
40 |
Number of Reflow Cycle |
3 |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Sn |
Under Plating Material |
N/A |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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Packaging |
Tray |
Quantity Of Packaging |
300 |
Packaging Document |
Link to Datasheet |
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