SPC5606BF1MLQ6 NXP Semiconductors IC MCU 32BIT 1MB FLASH 144LQFP

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2024/08/22 222
SPC5606BF1MLQ6 NXP Semiconductors IC MCU 32BIT 1MB FLASH 144LQFP


CATALOG
SPC5606BF1MLQ6 COUNTRY OF ORIGIN
SPC5606BF1MLQ6 PARAMETRIC INFO
SPC5606BF1MLQ6 PACKAGE INFO
SPC5606BF1MLQ6 MANUFACTURING INFO
SPC5606BF1MLQ6 PACKAGING INFO


COUNTRY OF ORIGIN
Malaysia
Taiwan (Province of China)


PARAMETRIC INFO
Family Name MPC56xx
Data Bus Width (bit) 32
Device Core e200z0h
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 64
Program Memory Type Flash
Program Memory Size 1MB
RAM Size 80KB
Data Memory Size 64KB
Maximum CPU Frequency (MHz) 64
Number of Programmable I/Os 121
Number of Timers 2
ADC Channels 19/15/19/5
ADC Resolution (bit) 10/10/12/12
Core Architecture e200
Number of ADCs Quad
PWM 1
Watchdog 1
Parallel Master Port No
Real Time Clock Yes
Special Features CAN Controller
Interface Type CAN/I2C/SCI/SPI
Programmability Yes
SPI 5
I2C 1
Process Technology 90nm
I2S 0
UART 0
USART 0
CAN 6
USB 0
Ethernet 0
Minimum Operating Supply Voltage (V) 3|4.5
Typical Operating Supply Voltage (V) 3.3|5
Maximum Operating Supply Voltage (V) 3.6|5.5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Temperature Flag Opr
Supplier Temperature Grade Automotive
Operating Supply Voltage (V) 3.3|5
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -55


PACKAGE INFO
Supplier Package LQFP
Basic Package Type Lead-Frame SMT
Pin Count 144
Lead Shape Gull-wing
PCB 144
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 20
Package Width (mm) 20
Package Height (mm) 1.45(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 22
Package Overall Width (mm) 22
Package Overall Height (mm) 1.6(Max)
Seated Plane Height (mm) 1.6(Max)
Mounting Surface Mount
Package Weight (g) 1.3191
Package Material Plastic
Package Description Low Profile Quad Flat Package
Package Family Name QFP
Jedec MS-026BFB
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 40
Number of Reflow Cycle 3
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Sn
Under Plating Material N/A
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Tray
Quantity Of Packaging 300
Packaging Document Link to Datasheet

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