SPC560C50L3C6E0X STMicroelectronics IC MCU 32BIT 512KB FLASH 100LQFP

label:

2023/09/13 506

• High-performance 64 MHz e200z0h CPU
– 32-bit Power Architecture® technology
– Up to 60 DMIPs operation
– Variable length encoding (VLE)

• Memory
– Up to 512 KB Code Flash with ECC
– 64 KB Data Flash with ECC
– Up to 48 KB SRAM with ECC
– 8-entry memory protection unit (MPU)

• Interrupts
– 16 priority levels
– Non-maskable interrupt (NMI)
– Up to 34 external interrupts incl. 18 wakeup lines

• GPIO: 45(LQFP64), 75(LQFP100), 123(LQFP144)

• Timer units
– 6-channel 32-bit periodic interrupt timers
– 4-channel 32-bit system timer module
– Software watchdog timer
– Real-time clock timer

• 16-bit counter time-triggered I/Os
– Up to 56 channels with PWM/MC/IC/OC
– ADC diagnostic via CTU

• Communications interface
– Up to 6 FlexCAN interfaces (2.0B active) with 64-message objects each
– Up to 4 LINFlex/UART
– 3 DSPI / I2C

• Single 5 V or 3.3 V supply

• 10-bit analog-to-digital converter (ADC) with up to 36 channels
– Extendable to 64 channels via external multiplexing
– Individual conversion registers
– Cross triggering unit (CTU)

• Dedicated diagnostic module for lighting
– Advanced PWM generation
– Time-triggered diagnostic
– PWM-synchronized ADC measurements

• Clock generationClock generation
– 4 to 16 MHz fast external crystal oscillator (FXOSC)
– 32 kHz slow external crystal oscillator (SXOSC)
– 16 MHz fast internal RC oscillator (FIRC)
– 128 kHz slow internal RC oscillator (SIRC)
– Software-controlled FMPLL
– Clock monitor unit (CMU)

• Exhaustive debugging capability
– Nexus1 on all devices
– Nexus2+ available on emulation package (LBGA208)

• Low power capabilities
– Ultra-low power standby with RTC, SRAM and CAN monitoring
– Fast wakeup schemes

• Operating temp. range up to -40 to 125 °C

CATALOG

SPC560C50L3C6E0X COUNTRY OF ORIGIN

SPC560C50L3C6E0X PARAMETRIC INFO

SPC560C50L3C6E0X PACKAGE INFO

SPC560C50L3C6E0X MANUFACTURING INFO

SPC560C50L3C6E0X PACKAGING INFO

COUNTRY OF ORIGIN

Malta

PARAMETRIC INFO

Data Bus Width (bit)	32
Family Name	MPC56xx
Device Core	e200z0h
Instruction Set Architecture	RISC
Maximum Clock Rate (MHz)	64
Program Memory Type	Flash
Program Memory Size	512KB
RAM Size	48KB
Data Memory Size	64KB
Maximum CPU Frequency (MHz)	64
Number of Programmable I/Os	79
Number of Timers	2
ADC Channels	28
ADC Resolution (bit)	10
Core Architecture	e200
Number of ADCs	Single
Watchdog	1
Parallel Master Port	No
Real Time Clock	Yes
Special Features	CAN Controller
Interface Type	CAN/I2C/SCI/SPI
Programmability	Yes
SPI	3
I2C	1
I2S	0
UART	0
USART	0
CAN	6
USB	0
Ethernet	0
Minimum Operating Supply Voltage (V)	3\|4.5
Typical Operating Supply Voltage (V)	3.3\|5
Maximum Operating Supply Voltage (V)	3.6\|5.5
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	125
Temperature Flag	Opr
Supplier Temperature Grade	Automotive
Operating Supply Voltage (V)	3.3\|5
Maximum Storage Temperature (°C)	150
Minimum Storage Temperature (°C)	-55

PACKAGE INFO

Supplier Package	LQFP
Basic Package Type	Lead-Frame SMT
Pin Count	100
Lead Shape	Gull-wing
PCB	100
Tab	N/R
Pin Pitch (mm)	0.5
Package Length (mm)	14
Package Width (mm)	14
Package Height (mm)	1.4
Package Diameter (mm)	N/R
Package Overall Length (mm)	16
Package Overall Width (mm)	16
Package Overall Height (mm)	1.6(Max)
Seated Plane Height (mm)	1.6(Max)
Mounting	Surface Mount
Package Weight (g)	N/A
Package Material	Plastic
Package Description	Low Profile Quad Flat Package
Package Family Name	QFP
Jedec	MS-026BED
Package Outline	Link to Datasheet

MANUFACTURING INFO

MSL	3
Maximum Reflow Temperature (°C)	260
Number of Reflow Cycle	3
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Wave Temp. Source	Link to Datasheet
Lead Finish(Plating)	Matte Sn annealed
Under Plating Material	Ag
Terminal Base Material	Cu Alloy
Shelf Life Period	2 Years

PACKAGING INFO

Packaging Suffix	X
Packaging	Tape and Reel
Quantity Of Packaging	1000
Packaging Document	Link to Datasheet