SPM4012T-4R7M-LR TDK FIXED IND 4.7UH 1.7A 196.7 MOHM

label:
2024/12/24 83
SPM4012T-4R7M-LR TDK  FIXED IND 4.7UH 1.7A 196.7 MOHM


• Magnetic shield type wound inductor for power circuits using a metallic magnetic material
• Low-profile product.
• Compared to ferrite wound type inductors, it is possible to achieve large current, low Rdc, and compactness
• Low inductance variance in high-temperature environments with good DC superimposition characteristics.
• Metallic magnetic material is used, and the structure has an integrated molded coil, so hum noise is lower than with core adhesive coils.
• Operating temperature range: –40 to +125 °C (including self-temperature rise)


CATALOG
SPM4012T-4R7M-LR COUNTRY OF ORIGIN
SPM4012T-4R7M-LR PARAMETRIC INFO
SPM4012T-4R7M-LR PACKAGE INFO
SPM4012T-4R7M-LR MANUFACTURING INFO
SPM4012T-4R7M-LR PACKAGING INFO
SPM4012T-4R7M-LR APPLICATION


COUNTRY OF ORIGIN
China


PARAMETRIC INFO
Type Power
Technology Wirewound
Protection Style Shielded
Core Material Metal
Inductance (H) 4.7u
Tolerance 20%
Inductance Test Frequency (Hz) 100K
Maximum DC Current (A) 1.7(Typ)
Typical Temperature Rise (°C) 40
Maximum Saturation Current (A) 3.3(Typ)
Maximum DC Resistance (Ohm) 0.1967
Inductance Decrease Percentage @ Isat (%) 30
Maximum Operating Temperature (°C) 125
Minimum Operating Temperature (°C) -40
Operating Temperature (°C) -40 to 125


PACKAGE INFO
Case Size N/A
Maximum Product Length (mm) 4.6
Maximum Product Depth (mm) 4.3
Maximum Product Height (mm) 1.2
Maximum Product Diameter (mm) N/R
Number of Terminals 2
Product Weight (g) 0.0941
Terminal Pitch (mm) N/R
Mounting Surface Mount
Product Diameter (mm) N/R


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 10
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) N/A
Under Plating Material N/A
Terminal Base Material N/A


PACKAGING INFO
Packaging Suffix T
Packaging Tape and Reel
Quantity Of Packaging 1000
Packaging Document Link to Datasheet


APPLICATION
• Tablet terminals, note PCs, HDDs, servers, VRMs, compact power supply modules, other
• Application guides: Smart phones/tablets

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