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• High performance 16-bit CPU with DSP functions– 50ns instruction cycle time at 40 MHz max CPU clock– Multiply/accumulate unit (MAC) 16 x 16-bit multiplication, 40-bit accumulator– Enhanced boolean bit manipulations– Single-cycle context switching support
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• Memory organization– 512 Kbyte on-chip Flash memory single voltage with erase/program controller (full performance, 32-bit fetch)– 100K erasing/programming cycles.– Up to 16 Mbyte linear address space for code and data (5 Mbytes with CAN or I2C)– 2 Kbyte on-chip internal RAM (IRAM)– 34 Kbyte on-chip extension RAM (XRAM)– Programmable external bus configuration and characteristics for different address ranges– 5 programmable chip-select signals– Hold-acknowledge bus arbitration support
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• Interrupt– 8-channel peripheral event controller for single cycle interrupt driven data transfer– 16-priority-level interrupt system with 56
sources, sampling rate down to 25ns
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• Timers– 2 multifunctional general purpose timer units with 5 timers |
• Two 16-channel capture / compare units |
• 4-channel PWM unit + 4-channel XPWM |
• 24-channel A/D converter– 16-channel 10-bit, accuracy +/-2 LSB– 8-channel 10-bit, accuracy +/-5 LSB– 4.85µs Minimum conversion time |
• Serial channels– 2 synch. / asynch. serial channels– 2 high-speed synchronous channels– I2C standard interface |
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CATALOG |
ST10F273M-4T3 COUNTRY OF ORIGIN |
ST10F273M-4T3 PARAMETRIC INFO
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ST10F273M-4T3 PACKAGE INFO
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ST10F273M-4T3 MANUFACTURING INFO
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ST10F273M-4T3 PACKAGING INFO
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COUNTRY OF ORIGIN |
China |
Malta |
Morocco |
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PARAMETRIC INFO
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Family Name |
ST10 |
Data Bus Width (bit) |
16 |
Device Core |
ST10 |
Instruction Set Architecture |
CISC|RISC |
Maximum Clock Rate (MHz) |
40 |
Program Memory Type |
Flash |
Program Memory Size |
512KB |
RAM Size |
36KB |
Maximum Expanded Memory Size |
16MB |
Maximum CPU Frequency (MHz) |
40 |
Number of Programmable I/Os |
111 |
Number of Timers |
5 |
ADC Channels |
8/8 |
ADC Resolution (bit) |
10 |
Number of ADCs |
Single |
PWM |
4 |
Watchdog |
1 |
Special Features |
CAN Controller |
Interface Type |
CAN/I2C |
Programmability |
Yes |
SPI |
0 |
I2C |
1 |
I2S |
0 |
UART |
0 |
USART |
0 |
CAN |
2 |
USB |
0 |
Ethernet |
0 |
Minimum Operating Supply Voltage (V) |
4.5 |
Typical Operating Supply Voltage (V) |
5 |
Maximum Operating Supply Voltage (V) |
5.5 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
125 |
Temperature Flag |
Opr |
Supplier Temperature Grade |
Automotive |
Operating Supply Voltage (V) |
5 |
Maximum Storage Temperature (°C) |
150 |
Minimum Storage Temperature (°C) |
-65 |
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PACKAGE INFO
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Supplier Package |
LQFP |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
144 |
Lead Shape |
Gull-wing |
PCB |
144 |
Tab |
N/R |
Pin Pitch (mm) |
0.5 |
Package Length (mm) |
20 |
Package Width (mm) |
20 |
Package Height (mm) |
1.4 |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
22 |
Package Overall Width (mm) |
22 |
Package Overall Height (mm) |
1.6(Max) |
Seated Plane Height (mm) |
1.6(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Low Profile Quad Flat Package |
Package Family Name |
QFP |
Jedec |
MS-026BFB |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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MSL |
3 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Matte Sn annealed |
Under Plating Material |
N/A |
Terminal Base Material |
Cu Alloy |
Shelf Life Period |
2 Years |
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PACKAGING INFO
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Packaging |
Tray |
Quantity Of Packaging |
60 |
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