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• Core: Arm® 32-bit Cortex®-M0 CPU, frequency up to 48 MHz
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• Memories– 16 to 256 Kbytes of Flash memory– 4 to 32 Kbytes of SRAM with HW parity
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• CRC calculation unit
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• Calendar RTC with alarm and periodic wakeupfrom Stop/Standby
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• Reset and power management– Digital & I/Os supply: VDD = 2.4 V to 3.6 V– Analog supply: VDDA = VDD to 3.6 V– Power-on/Power down reset (POR/PDR)– Low power modes: Sleep, Stop, Standby
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| CATALOG |
STM32F030K6T6 COUNTRY OF ORIGIN
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STM32F030K6T6 PARAMETRIC INFO
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STM32F030K6T6 PACKAGE INFO
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STM32F030K6T6 MANUFACTURING INFO
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STM32F030K6T6 PACKAGING INFO
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STM32F030K6T6 ECAD MODELS
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COUNTRY OF ORIGIN
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China
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PARAMETRIC INFO
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| Tradename |
STM32 |
| Family Name |
STM32F |
| Data Bus Width (bit) |
32 |
| Device Core |
ARM Cortex M0 |
| Instruction Set Architecture |
RISC |
| Maximum Clock Rate (MHz) |
48 |
| Program Memory Type |
Flash |
| Program Memory Size |
32KB |
| RAM Size |
4KB |
| Input Capture Channels |
4 |
| Output Compare Channels |
4 |
| Internal/External Clock Type |
Internal/External |
| Touch Sensing Interface |
No |
| Power On Reset |
Yes |
| Memory Protection Unit |
No |
| Temperature Sensor |
Yes |
| DDR |
No |
| Memory Management Unit |
No |
| Integrated Development Environment |
No |
| Super Scalar |
No |
| External Bus Interface |
No |
| DMA Channels |
5 |
| Direct Memory Access |
Yes |
| Floating Point Unit |
No |
| Bluetooth |
No |
| Wi-Fi |
No |
| Multiply Accumulate |
No |
| Maximum CPU Frequency (MHz) |
48 |
| Number of Programmable I/Os |
26 |
| Number of Timers |
5 |
| ADC Channels |
12 |
| ADC Resolution (bit) |
12 |
| Core Architecture |
ARM |
| Number of ADCs |
1 |
| Watchdog |
1 |
| Parallel Master Port |
No |
| Real Time Clock |
Yes |
| Interface Type |
I2C/SPI/USART |
| Programmability |
Yes |
| SPI |
1 |
| I2C |
1 |
| I2S |
0 |
| UART |
0 |
| USART |
1 |
| CAN |
0 |
| USB |
0 |
| Ethernet |
0 |
| Maximum Power Dissipation (mW) |
357 |
| Minimum Operating Supply Voltage (V) |
2.4 |
| Typical Operating Supply Voltage (V) |
2.5|3.3 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Temperature Flag |
Opr |
| Operating Supply Voltage (V) |
2.5|3.3 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
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PACKAGE INFO
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| Supplier Package |
LQFP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
32 |
| Lead Shape |
Gull-wing |
| PCB |
32 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.8 |
| Package Length (mm) |
7 |
| Package Width (mm) |
7 |
| Package Height (mm) |
1.4 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1.6(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Low Profile Quad Flat Package |
| Package Family Name |
QFP |
| Jedec |
MS-026BBA |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
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PACKAGING INFO
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| Packaging |
Tray |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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