STM32F427ZGT6 STMicroelectronics 32b Arm® Cortex®-M4 MCU+FPU, 225DMIPS, up to 2MB Flash/256+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 20 com. interfaces, camera & LCD-TFT

label:
2023/09/26 573



CATALOG
STM32F427ZGT6 COUNTRY OF ORIGIN
STM32F427ZGT6 PARAMETRIC INFO
STM32F427ZGT6 PACKAGE INFO
STM32F427ZGT6 MANUFACTURING INFO
STM32F427ZGT6 PACKAGING INFO
STM32F427ZGT6 ECAD MODELS


COUNTRY OF ORIGIN
France
China
Philippines
Taiwan (Province of China)


PARAMETRIC INFO
Tradename STM32
Data Bus Width (bit) 32
Family Name STM32F
Device Core ARM Cortex M4
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 180
Program Memory Type Flash
Program Memory Size 1MB
RAM Size 260KB
Hardware Acceleration FPU
Trace Hardware JTAG/SWD
Maximum Dhrystone MIPS (MIPS) 1.25
DMA Channels 16
CAN Type 2.0B
Direct Memory Access Yes
Floating Point Unit Yes
Bluetooth No
Wi-Fi No
Ethernet Interface Type MII/RMII
Ethernet Speed 10Mbps/100Mbps
Multiply Accumulate No
Input Capture Channels 4
Output Compare Channels 4
Internal/External Clock Type Internal/External
Touch Sensing Interface No
Power On Reset No
Memory Protection Unit Yes
Temperature Sensor Yes
DDR No
Memory Management Unit No
Integrated Development Environment No
Super Scalar No
External Bus Interface No
Maximum CPU Frequency (MHz) 180
Number of Programmable I/Os 114
Number of Timers 14
ADC Channels 24/24/24
ADC Resolution (bit) 12/12/12
DAC Channels 2/2
Core Architecture ARM
Number of ADCs Triple
DAC Resolution (bit) 12/12
Number of DACs Dual
PWM 2
Watchdog 2
Parallel Master Port No
Real Time Clock Yes
Special Features CAN Controller
Timers Resolution (bit) 16/32
Interface Type CAN/Ethernet/I2C/I2S/SPI/UART/USART/USB
Programmability Yes
SPI 6
I2C 3
I2S 2
UART 4
USART 4
CAN 2
USB 2
Ethernet 1
Maximum Power Dissipation (mW) 500
Minimum Operating Supply Voltage (V) 1.8
Typical Operating Supply Voltage (V) 2.5|3.3
Maximum Operating Supply Voltage (V) 3.6
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Supplier Temperature Grade Industrial
Operating Supply Voltage (V) 2.5|3.3
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package LQFP
Basic Package Type Lead-Frame SMT
Pin Count 144
Lead Shape Gull-wing
PCB 144
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 20
Package Width (mm) 20
Package Height (mm) 1.4
Package Diameter (mm) N/R
Package Overall Length (mm) 22
Package Overall Width (mm) 22
Package Overall Height (mm) 1.6(Max)
Seated Plane Height (mm) 1.6(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Low Profile Quad Flat Package
Package Family Name QFP
Jedec MS-026BFB
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL N/A
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Sn|Au
Under Plating Material N/A|Pd over Ni
Terminal Base Material Cu Alloy
Shelf Life Period 2 Years
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Tray
Packaging Document Link to Datasheet


ECAD MODELS



Продукт RFQ