
|
|
■ Very small conduction losses
|
■ Negligible switching losses
|
■ Extremely fast switching
|
■ Low forward voltage drop for higher efficiency and extented battery life
|
■ Low thermal resistance
|
■ Avalanche capability specified
|
|
CATALOG |
STPS1L40M COUNTRY OF ORIGIN
|
STPS1L40M PARAMETRIC INFO
|
STPS1L40M PACKAGE INFO
|
STPS1L40M MANUFACTURING INFO
|
STPS1L40M PACKAGING INFO
|
STPS1L40M ECAD MODELS
|
|
COUNTRY OF ORIGIN
|
China
|
|
PARAMETRIC INFO
|
Type |
Schottky Diode |
Configuration |
Single |
Peak Reverse Repetitive Voltage (V) |
40 |
Maximum Continuous Forward Current (A) |
1 |
Maximum Junction Case Thermal Resistance |
20°C/W |
Peak Forward Voltage (V) |
0.6@3A |
Peak Non-Repetitive Surge Current (A) |
50 |
Peak Reverse Current (uA) |
63 |
Operating Junction Temperature (°C) |
150 |
Minimum Operating Temperature (°C) |
-65 |
Maximum Operating Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
Supplier Package |
ST Mite |
Pin Count |
2 |
PCB |
1 |
Tab |
Tab |
Package Length (mm) |
1.9 |
Package Width (mm) |
1.9 |
Package Height (mm) |
1 |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
3.75 |
Package Overall Width (mm) |
1.9 |
Package Overall Height (mm) |
1 |
Seated Plane Height (mm) |
1 |
Mounting |
Surface Mount |
Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
IPC-1752 |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Wave Temp. Source |
Link to Datasheet |
Lead Finish(Plating) |
Matte Sn |
Under Plating Material |
N/A |
Terminal Base Material |
Cu Alloy |
Shelf Life Period |
2 Years |
|
|
PACKAGING INFO
|
Packaging |
Tape and Reel |
Quantity Of Packaging |
1000 |
|
|
ECAD MODELS
|

|