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• Mono Class-D BTL Speaker Amplifier– 2.6 W at 10% THD_N (4Ω, 5.5 V)– 1.7 W at 10% THD+N (8 Ω, 5.5 V)
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• Supports both Digital and Analog Input
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• Single Supply 2.7 V to 5.5 V
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• Load Diagnostic Functions:– Output-to-GND Short– Terminal-to-Terminal Short– Output-to-Power Short– Over Temperature– Input DC |
• Supports 9-kHz to 96-kHz Sample Rates |
• Two Single-Ended Inputs with Output Mixing and Level Control |
• Embedded Power-On-Reset |
• Programmable Digital Audio Processing:– Bass Boost– Treble– EQ (up to 6 Biquads) |
• I2S, Left-Justified, Right-Justified, DSP, and TDM Audio Interfaces |
• I2C and SPI Control With Auto-Increment |
• 24-Pin, VQFN Package |
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CATALOG |
TAS2505IRGER COUNTRY OF ORIGIN |
TAS2505IRGER PARAMETRIC INFO
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TAS2505IRGER PACKAGE INFO
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TAS2505IRGER MANUFACTURING INFO
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TAS2505IRGER PACKAGING INFO
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TAS2505IRGER EACD MODELS
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TAS2505IRGER APPLICATIONS |
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COUNTRY OF ORIGIN |
Thailand |
Philippines |
China |
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PARAMETRIC INFO
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Amplifier Type |
Class-D |
Function |
Headphone/Speaker |
Input Signal Type |
Single |
Output Signal Type |
Differential|Single |
Output Type |
1-Channel Mono |
Power Supply Type |
Triple |
Minimum Dual Supply Voltage (V) |
1.5|1.65|2.7 |
Typical Dual Supply Voltage (V) |
1.8|3|5 |
Maximum Dual Supply Voltage (V) |
1.95|5.5 |
Minimum Load Resistance (Ohm) |
4 |
Maximum Load Resistance (Ohm) |
32 |
Typical Output Power (W) |
1.7 |
Maximum Output Power (W) |
2 |
Typical Output Power x Channels @ Load (W) |
1.7x1@8Ohm|0.018x1@16Ohm |
Maximum Output Power x Channels @ Load (W) |
2x1@4Ohm |
Maximum Input Bias Current (uA) |
55(Typ)@1.8V|55(Typ)@3.6V |
Typical PSRR (dB) |
55 |
Total Harmonic Distortion Noise |
0.01% |
Typical Voltage Gain (dB) |
12.04 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Minimum Storage Temperature (°C) |
-55 |
Maximum Storage Temperature (°C) |
150 |
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PACKAGE INFO
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Supplier Package |
VQFN EP |
Basic Package Type |
Non-Lead-Frame SMT |
Pin Count |
24 |
Lead Shape |
No Lead |
PCB |
24 |
Tab |
N/R |
Pin Pitch (mm) |
0.5 |
Package Length (mm) |
4.15(Max) |
Package Width (mm) |
4.15(Max) |
Package Height (mm) |
0.95(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
4.15(Max) |
Package Overall Width (mm) |
4.15(Max) |
Package Overall Height (mm) |
1(Max) |
Seated Plane Height (mm) |
1(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Very Thin Quad Flat No Lead Package, Exposed Pad |
Package Family Name |
QFN |
Jedec |
N/A |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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MSL |
2 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Au |
Under Plating Material |
Pd over Ni |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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Packaging Suffix |
RG |
Packaging |
Tape and Reel |
Quantity Of Packaging |
3000 |
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ECAD MODELS
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APPLICATIONS |
• Instrument Cluster
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• Automotive Emergency Call (eCall) |
• Telematics |
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