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• PWM/DIR-interface drives 4 N-Channel Power MOSFETs
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• Unlimited D.C. switch on time of low and high-side MOSFETs
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• 0 … 95% at 20 kHz & 100% duty cycle of high-side MOSFETs
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• 0 … 100% duty cycle of low-side MOSFETs
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• Additional output to drive a reverse polarity protection N-MOSFET |
• Current sense OPAMP |
• Low quiescent current mode |
• Internal shoot through protection |
• Adjustable dead time |
• 1-bit diagnosis / ERR |
• Overcurrent warning based on current sense OPAMP with fixed warning level |
• Analog adjustable short circuit protection levels via SCDL pin with open pin detection |
• Overtemperature warning |
• Overvoltage warning |
• Undervoltage warning and shutdown |
• Green Product (RoHS compliant) |
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CATALOG |
TLE7181EMXUMA1 COUNTRY OF ORIGIN |
TLE7181EMXUMA1 PARAMETRIC INFO
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TLE7181EMXUMA1 PACKAGE INFO
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TLE7181EMXUMA1 MANUFACTURING INFO
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TLE7181EMXUMA1 PACKAGING INFO
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TLE7181EMXUMA1 ECAD MODELS
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TLE7181EMXUMA1 APPLICATIONS |
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COUNTRY OF ORIGIN |
Malaysia |
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PARAMETRIC INFO
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type |
Motor Driver |
Maximum Operating Current (mA) |
45 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
150 |
Minimum Operating Supply Voltage (V) |
7 |
Operating Supply Voltage (V) |
7 to 34 |
Maximum Operating Supply Voltage (V) |
34 |
Maximum Power Dissipation (mW) |
2000 |
Minimum Storage Temperature (°C) |
-55 |
Maximum Storage Temperature (°C) |
150 |
Output Configuration |
H-Bridge |
Motor Type |
Brush DC Motor |
Number of Phases |
2 |
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PACKAGE INFO
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Supplier packaging |
SSOP EP |
Basic package type |
Lead-Frame SMT |
Number of pins |
twenty four |
Pin shape |
Gull-wing |
PCB |
twenty four |
ears |
N/R |
Pin spacing (mm) |
0.65 |
Package length (mm) |
8.65 |
Package width (mm) |
3.9 |
Package height (mm) |
1.47 |
Package diameter (mm) |
N/R |
Mounting surface height (mm) |
1.7(Max) |
Install |
Surface Mount |
Packaging materials |
Plastic |
package instruction |
Shrink Small Outline Package, Exposed Pad |
Package series name |
SO |
JEDEC |
MO-137AE |
Package outline |
Link to datasheet |
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MANUFACTURING INFO
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MSL |
3 |
Maximum reflow temperature (°C) |
260 |
Reflow soldering time (seconds) |
20 to 40 |
Number of reflow cycles |
3 |
standard |
J-STD-020C |
Reflow temperature source |
Link to datasheet |
Maximum wave soldering temperature (°C) |
N/R |
Wave soldering time (seconds) |
N/R |
Wave soldering temperature source |
Link to datasheet |
Lead Finish(Plating) |
Matte Sn annealed |
Plating materials |
not applicable |
Terminal Base Material |
not applicable |
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PACKAGING INFO
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Package |
Tape and reel packaging |
Packing quantity |
2500 |
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ECAD MODELS
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APPLICATIONS
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• General automotive applications.
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