TM4C123BH6PGEIR Texas Instruments IC MCU 32BIT 256KB FLASH 144LQFP

label:
2024/03/28 263



CATALOG
TM4C123BH6PGEIR COUNTRY OF ORIGIN
TM4C123BH6PGEIR PARAMETRIC INFO
TM4C123BH6PGEIR PACKAGE INFO
TM4C123BH6PGEIR MANUFACTURING INFO
TM4C123BH6PGEIR PACKAGING INFO
TM4C123BH6PGEIR EACD MODELS


COUNTRY OF ORIGIN
Philippines


PARAMETRIC INFO
Data Bus Width (bit) 32
Series name Tiva C
Device Core ARM Cortex M4F
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 80
Program Memory Type Flash
Program Memory Size 256KB
RAM Size 32KB
Maximum CPU Frequency (MHz) 80
Number of Programmable I/Os 105
Number of Timers 12
ADC Channels 24/24
ADC Resolution (bit) 12/12
Number of ADCs Dual
Core Architecture ARM
PWM 16
Watchdog 1
Analog Comparators 2
Parallel Master Port no
Real Time Clock yes
Special Features CAN Controller
Interface Type CAN/I2C/I2S/SPI/UART
Programmability yes
SPI 4
I2C 6
I2S 4
UART 8
USART 0
CAN 2
USB 0
Ethernet 0
Minimum Operating Supply Voltage (V) 1.08|2.97
Typical Operating Supply Voltage (V) 1.2|3.3
Maximum Operating Supply Voltage (V) 1.32|3.63
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Supplier Temperature Rating Industrial
Operating Supply Voltage (V) 1.2|3.3
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65
 


PACKAGE INFO
Supplier packaging LQFP
Basic package type Lead-Frame SMT
Number of pins 144
Pin shape Gull-wing
PCB 144
ears N/R
Pin spacing (mm) 0.5
Package length (mm) 20.2(Max)
Package width (mm) 20.2(Max)
Package height (mm) 1.45(Max)
Package diameter (mm) N/R
Package Overall Length (mm) 22.2(Max)
Package Overall Width (mm) 22.2(Max)
Package Overall Height (mm) 1.6(Max)
Mounting surface height (mm) 1.6(Max)
Install Surface Mount
Package weight (g) not applicable
Packaging materials Plastic
package instruction Low Profile Quad Flat Package
Package series name QFP
JEDEC MS-026BFB
Package outline Link to datasheet
 


MANUFACTURING INFO
MSL 3
Maximum reflow temperature (°C) 260
Reflow soldering time (seconds) 30
Number of reflow cycles 3
standard J-STD-020D
Reflow temperature source Link to datasheet
Maximum wave soldering temperature (°C) N/R
Wave soldering time (seconds) N/R
Lead Finish(Plating) Au
Plating materials Pd over Ni
Terminal Base Material Cu Alloy
 


PACKAGING INFO
Packaging Suffix R
Package Tape and reel packaging
 


ECAD MODELS

Продукт RFQ