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• AEC-Q100 qualified with the following results:
– Temperature grade 1: −55°C to +125°C
operating temperature range
– HBM ESD component classification level 2
– CDM ESD component classification level C5
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• Functional Safety-Capable
– Documentation available to aid functional safety
system design
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• Digital output: SMBus™, two-wire, and I2C
interface compatibility |
• Resolution: 9 to 12 bits, user-selectable |
• Accuracy:
– ±1°C (typical) from –55°C to 125°C
– ±2°C (maximum) from –55°C to 125°C |
• Low quiescent current: 45-μA, 0.1-μA standby |
• Wide supply range: 2.7 V to 5.5 V |
• TMP100-Q1 features two address pins |
• TMP101-Q1 features one address pin and an
ALERT pin
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• 6-pin SOT-23 package |
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CATALOG |
TMP101NAQDBVRQ1 COUNTRY OF ORIGIN |
TMP101NAQDBVRQ1 PARAMETRIC INFO |
TMP101NAQDBVRQ1 PACKAGE INFO |
TMP101NAQDBVRQ1 MANUFACTURING INFO |
TMP101NAQDBVRQ1 PACKAGING INFO |
TMP101NAQDBVRQ1 ECAD MODELS |
TMP101NAQDBVRQ1 FUNCTIONAL BLOCK DIAGRAM |
TMP101NAQDBVRQ1 APPLICATIONS
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COUNTRY OF ORIGIN |
China |
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PARAMETRIC INFO |
Function |
Temp Sensor |
Interface Type |
Serial (2-Wire, I2C, SMBus) |
Resolution (bit) |
12 |
Output Type |
Digital |
Module/IC Classification |
IC |
Minimum Operating Supply Voltage (V) |
2.7 |
Typical Operating Supply Voltage (V) |
3.3|5 |
Operating Temperature (°C) |
-40 to 125 |
Operating Range |
-40°C to 125°C |
Maximum Operating Supply Voltage (V) |
5.5 |
Maximum Supply Current (uA) |
75 |
Accuracy |
±1°C |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
125 |
Supplier Temperature Grade |
Automotive |
Output Driver |
Open Drain |
Operating Supply Voltage (V) |
2.7 to 5.5 |
Minimum Storage Temperature (°C) |
-60 |
Maximum Storage Temperature (°C) |
150 |
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PACKAGE INFO |
Supplier Package |
SOT-23 |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
6 |
Lead Shape |
Gull-wing |
PCB |
6 |
Tab |
N/R |
Pin Pitch (mm) |
0.95 |
Package Length (mm) |
3.05(Max) |
Package Width (mm) |
1.75(Max) |
Package Height (mm) |
1.1 |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
3.05(Max) |
Package Overall Width (mm) |
3(Max) |
Package Overall Height (mm) |
1.45(Max) |
Seated Plane Height (mm) |
1.45(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Small Outline Transistor |
Package Family Name |
SOT |
Jedec |
MO-178AB |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO |
MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Au |
Under Plating Material |
Pd over Ni |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO |
Packaging Suffix |
DBVR |
Packaging |
Tape and Reel |
Quantity Of Packaging |
3000 |
Reel Diameter (in) |
7 |
Tape Pitch (mm) |
4 |
Tape Width (mm) |
8 |
Component Orientation |
Q3 |
Packaging Document |
Link to Datasheet |
Tape Type |
Embossed |
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ECAD MODELS |
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FUNCTIONAL BLOCK DIAGRAM |
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APPLICATIONS
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• Power-supply temperature monitoring |
• Battery management |
• Thermostat controls |
• Automotive:
– Head unit
– Cluster
– Body electronics
– Lighting |
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