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CATALOG |
TMS320LF2406APZA COUNTRY OF ORIGIN |
TMS320LF2406APZA PARAMETRIC INFO
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TMS320LF2406APZA PACKAGE INFO
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TMS320LF2406APZA MANUFACTURING INFO
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TMS320LF2406APZA PACKAGING INFO
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TMS320LF2406APZA ECAD MODELS
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COUNTRY OF ORIGIN |
Taiwan (Province of China) |
Philippines |
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PARAMETRIC INFO
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Data Bus Width (bit) |
16 |
Family Name |
C2000 |
Device Core |
C2xx DSP |
Instruction Set Architecture |
Harvard |
Maximum Clock Rate (MHz) |
40 |
Program Memory Type |
Flash |
Program Memory Size |
64KB |
RAM Size |
5KB |
Maximum CPU Frequency (MHz) |
40 |
Number of Programmable I/Os |
41 |
Number of Timers |
4 |
ADC Channels |
16 |
ADC Resolution (bit) |
10 |
Number of ADCs |
Single |
Interface Type |
CAN/SCI/SPI |
Programmability |
Yes |
SPI |
1 |
I2C |
0 |
I2S |
0 |
UART |
0 |
USART |
0 |
CAN |
1 |
USB |
0 |
Ethernet |
0 |
Minimum Operating Supply Voltage (V) |
3 |
Typical Operating Supply Voltage (V) |
3.3 |
Maximum Operating Supply Voltage (V) |
3.6 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Temperature Flag |
Opr |
Operating Supply Voltage (V) |
3.3 |
Maximum Storage Temperature (°C) |
150 |
Minimum Storage Temperature (°C) |
-65 |
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PACKAGE INFO
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Supplier Package |
LQFP |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
100 |
Lead Shape |
Gull-wing |
PCB |
100 |
Tab |
N/R |
Pin Pitch (mm) |
0.5 |
Package Length (mm) |
14.2(Max) |
Package Width (mm) |
14.2(Max) |
Package Height (mm) |
1.45(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
16.2(Max) |
Package Overall Width (mm) |
16.2(Max) |
Package Overall Height (mm) |
1.6(Max) |
Seated Plane Height (mm) |
1.6(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Low Profile Quad Flat Package |
Package Family Name |
QFP |
Jedec |
MS-026 |
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MANUFACTURING INFO
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MSL |
2 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Au |
Under Plating Material |
Pd over Ni |
Terminal Base Material |
Cu Alloy |
Number of Wave Cycles |
N/R |
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PACKAGING INFO
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Packaging |
Tray |
Quantity Of Packaging |
90 |
Packaging Document |
Link to Datasheet |
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ECAD MODELS
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