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• 33-mΩ (5-V Input) High-Side MOSFET Switch
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• Short-Circuit and Thermal Protection
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• Overcurrent Logic Output
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• Operating Range . . . 2.7 V to 5.5 V
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• Logic-Level Enable Input
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• Typical Rise Time . . . 6.1 ms
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• Undervoltage Lockout |
• Maximum Standby Supply Current . . . 10 μA |
• No Drain-Source Back-Gate Diode |
• Available in 8-Pin SOIC and PDIP Packages |
• Ambient Temperature Range, –40°C to 85°C |
• 2-kV Human-Body-Model, 200-V
Machine-Model ESD Protection |
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CATALOG |
TPS2021D COUNTRY OF ORIGIN
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TPS2021D PARAMETRIC INFO
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TPS2021D PACKAGE INFO
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TPS2021D MANUFACTURING INFO
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TPS2021D PACKAGING INFO
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TPS2021D ECAD MODELS
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COUNTRY OF ORIGIN
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China |
Mexico |
Taiwan (Province of China) |
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PARAMETRIC INFO
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Type |
USB Power Switch |
Number of Switches |
1 |
Minimum Input Voltage (V) |
2.7 |
Maximum Input Voltage (V) |
5.5 |
Current Limit (A) |
0.9 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Enable Logic |
Active Low |
Supply Current (mA) |
0.075 |
Typical Rise Time (us) |
8600 |
Minimum Output Current (A) |
0 |
Typical Fall Time (us) |
3400 |
Number of Outputs |
1 |
Typical Turn-On Delay Time (us) |
20000(Max) |
Operating Supply Voltage Range (V) |
2.7 to 5.5 |
Typical Turn-Off Delay Time (us) |
40000(Max) |
Output Voltage Range (V) |
-0.3 to 6.3 |
Typical UVLO Threshold (V) |
2.5(Max) |
Maximum Power Dissipation (mW) |
725 |
Switch On Resistance (mOhm) |
37 |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
150 |
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PACKAGE INFO
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Supplier Package |
SOIC |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
8 |
Lead Shape |
Gull-wing |
PCB |
8 |
Tab |
N/R |
Pin Pitch (mm) |
1.27 |
Package Length (mm) |
5(Max) |
Package Width (mm) |
3.98(Max) |
Package Height (mm) |
1.5(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
5(Max) |
Package Overall Width (mm) |
6.19(Max) |
Package Overall Height (mm) |
1.75(Max) |
Seated Plane Height (mm) |
1.75(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Small Outline IC |
Package Family Name |
SO |
Jedec |
MS-012AA |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Au |
Under Plating Material |
Pd over Ni |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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Packaging |
Tube |
Quantity Of Packaging |
75 |
Packaging Document |
Link to Datasheet |
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ECAD MODELS
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