TPS2021D Texas Instruments POWER-DISTRIBUTION SWITCHES

label:
2024/01/8 371



• 33-mΩ (5-V Input) High-Side MOSFET Switch
• Short-Circuit and Thermal Protection
• Overcurrent Logic Output
• Operating Range . . . 2.7 V to 5.5 V
• Logic-Level Enable Input
• Typical Rise Time . . . 6.1 ms
• Undervoltage Lockout
• Maximum Standby Supply Current . . . 10 μA
• No Drain-Source Back-Gate Diode
• Available in 8-Pin SOIC and PDIP Packages
• Ambient Temperature Range, –40°C to 85°C
• 2-kV Human-Body-Model, 200-V Machine-Model ESD Protection


CATALOG
TPS2021D COUNTRY OF ORIGIN
TPS2021D PARAMETRIC INFO
TPS2021D PACKAGE INFO
TPS2021D MANUFACTURING INFO
TPS2021D PACKAGING INFO
TPS2021D ECAD MODELS


COUNTRY OF ORIGIN
China
Mexico
Taiwan (Province of China)


PARAMETRIC INFO
Type USB Power Switch
Number of Switches 1
Minimum Input Voltage (V) 2.7
Maximum Input Voltage (V) 5.5
Current Limit (A) 0.9
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Enable Logic Active Low
Supply Current (mA) 0.075
Typical Rise Time (us) 8600
Minimum Output Current (A) 0
Typical Fall Time (us) 3400
Number of Outputs 1
Typical Turn-On Delay Time (us) 20000(Max)
Operating Supply Voltage Range (V) 2.7 to 5.5
Typical Turn-Off Delay Time (us) 40000(Max)
Output Voltage Range (V) -0.3 to 6.3
Typical UVLO Threshold (V) 2.5(Max)
Maximum Power Dissipation (mW) 725
Switch On Resistance (mOhm) 37
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150


PACKAGE INFO
Supplier Package SOIC
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 5(Max)
Package Width (mm) 3.98(Max)
Package Height (mm) 1.5(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 5(Max)
Package Overall Width (mm) 6.19(Max)
Package Overall Height (mm) 1.75(Max)
Seated Plane Height (mm) 1.75(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline IC
Package Family Name SO
Jedec MS-012AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Tube
Quantity Of Packaging 75
Packaging Document Link to Datasheet


ECAD MODELS


Продукт RFQ