TPS73633DBVR Texas Instruments IC REG LINEAR 3.3V 400MA SOT23-5

label:
2023/09/21 366


■ Stable with No Output Capacitor or Any Value or voltage Type of Capacitor
■ Input Voltage Range of 1.7 V to 5.5 V
■ Ultra-Low Dropout Voltage: 75 mV typ
■ Excellent Load Transient Response—with or without Optional Output Capacitor
■ New NMOS Topology Delivers Low Reverse Leakage Current
■ Less Than 1 μA max IQ in Shutdown Mode
■ Low Cost Due to Wafer-Level Trimming
■ 0.5% Initial Accuracy
■ Thermal Shutdown and Specified Min/Max Current Limit Protection


CATALOG
TPS73633DBVR COUNTRY OF ORIGIN
TPS73633DBVR PARAMETRIC INFO
TPS73633DBVR PACKAGE INFO
TPS73633DBVR MANUFACTURING INFO
TPS73633DBVR PACKAGING INFO
TPS73633DBVR ECAD MODELS
TPS73633DBVR APPLICATIONS


COUNTRY OF ORIGIN
Malaysia
China
Philippines
Thailand


PARAMETRIC INFO
Type LDO
Number of Outputs 1
Maximum Output Current (A) 0.4
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Output Type Fixed
Output Voltage Range (V) 1.8 to 10
Regulation Condition Change In Load 399mA
Regulation Condition Change In Line 1.7V
Junction to Ambient 221.9°C/W
Junction to Case 74.9°C/W
Polarity Positive
Special Features Current Limit|Reverse Current Protection|Thermal Shutdown Protection
Process Technology BiCMOS
Load Regulation 0.002%/mA(Typ)
Line Regulation 0.01%/V(Typ)
Maximum Quiescent Current (mA) 0.55
Maximum Dropout Voltage @ Current (V) 0.2@400mA
Minimum Input Voltage (V) 1.7
Maximum Input Voltage (V) 5.5
Output Voltage (V) 3.3
Typical Quiescent Current (mA) 0.4
Typical Dropout Voltage @ Current (V) 0.075@400mA
Accuracy (%) ±0.5
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Typical Ground Current @ Full Load (mA) 0.8
Typical PSRR (dB) 58
Typical Output Capacitance (uF) 0(Min)
Typical Output Noise Voltage (uVrms) 30
Pass Element Type NMOS


PACKAGE INFO
Supplier Package SOT-23
Basic Package Type Lead-Frame SMT
Pin Count 5
Lead Shape Gull-wing
PCB 5
Tab N/R
Pin Pitch (mm) 0.95
Package Length (mm) 3.05(Max)
Package Width (mm) 1.75(Max)
Package Height (mm) 1.1
Package Diameter (mm) N/R
Package Overall Length (mm) 3.05(Max)
Package Overall Width (mm) 3(Max)
Package Overall Height (mm) 1.45(Max)
Seated Plane Height (mm) 1.45(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline Transistor
Package Family Name SOT
Jedec MO-178


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) 260
Wave Solder Time (Sec) 4
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy
Number of Wave Cycles N/A


PACKAGING INFO
Packaging Suffix R
Packaging Tape and Reel
Quantity Of Packaging 3000
Reel Diameter (in) 7
Reel Width (mm) 9
Tape Pitch (mm) 4
Tape Width (mm) 8
Component Orientation Q3
Packaging Document Link to Datasheet


ECAD MODELS




APPLICATIONS
• Portable/Battery-Powered Equipment
• Post-Regulation for Switching Supplies
• Noise-Sensitive Circuitry such as VCOs
• Point of Load Regulation for DSPs, FPGAs, ASICs, and Microprocessors

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