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• 3.0-mm x 2.8-mm x 1.5-mm MicroSiP™ Package |
• 3.0-V to 17-V Input Range |
• 1-A Continuous Output Current |
• DCS-Control™ Topology |
• Power Save Mode for Light Load Efficiency |
• 20-µA Operating Quiescent Current |
• 0.9-V to 6-V Adjustable Output Voltage |
• 100% Duty Cycle for Lowest Dropout |
• Power Good Output |
• Programmable Soft Startup with Tracking |
• Thermal Shutdown Protection |
• Pin to Pin compatible with TPS82130 and
TPS82140 |
• –40°C to 125°C Operating Temperature Range |
• Create a Custom Design using the TPS82150 with
the WEBENCH® Power Designer |
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CATALOG |
TPS82150SILT COUNTRY OF ORIGIN |
TPS82150SILT PARAMETRIC INFO |
TPS82150SILT PACKAGE INFO |
TPS82150SILT MANUFACTURING INFO |
TPS82150SILT PACKAGING INFO |
TPS82150SILT ECAD MODELS |
TPS82150SILT FUNCTIONAL BLOCK DIAGRAM |
TPS82150SILT APPLICATIONS |
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COUNTRY OF ORIGIN |
Philippines |
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PARAMETRIC INFO |
Type |
Step Down |
Number of Outputs |
1 |
Output Voltage (V) |
0.9 to 6 |
Maximum Output Current (A) |
1 |
Minimum Operating Temperature (°C) |
-40 |
Tradename |
MicroSiP™ |
Maximum Operating Temperature (°C) |
125 |
Switching Regulator |
Yes |
Minimum Input Voltage (V) |
3 |
Maximum Input Voltage (V) |
17 |
Output Type |
Adjustable |
Load Regulation |
0.12%/A(Typ) |
Line Regulation |
0.002%/V(Typ) |
Switching Frequency (kHz) |
2000(Typ) |
Typical Standby Current (mA) |
0.0015 |
Minimum Storage Temperature (°C) |
-55 |
Maximum Storage Temperature (°C) |
125 |
On/Off Logic |
Positive |
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PACKAGE INFO |
Supplier Package |
uSIP SMD EP |
Pin Count |
8 |
PCB |
8 |
Tab |
N/R |
Pin Pitch (mm) |
0.65 |
Package Length (mm) |
3.1(Max) |
Package Width (mm) |
2.9(Max) |
Package Height (mm) |
1.53(Max) |
Package Diameter (mm) |
N/R |
Seated Plane Height (mm) |
1.53(Max) |
Mounting |
Surface Mount |
Package Family Name |
SIP |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO |
MSL |
2 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Au |
Under Plating Material |
Ni |
Terminal Base Material |
N/A |
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PACKAGING INFO |
Packaging Suffix |
T |
Packaging |
Tape and Reel |
Quantity Of Packaging |
250 |
Reel Diameter (in) |
7 |
Reel Width (mm) |
13.2 |
Tape Pitch (mm) |
8 |
Tape Width (mm) |
12 |
Component Orientation |
Q1 |
Packaging Document |
Link to Datasheet |
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ECAD MODELS |
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FUNCTIONAL BLOCK DIAGRAM |
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APPLICATIONS |
• Industrial Applications |
• Telecom and Networking Applications |
• Solid State Drives
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• Inverting Power Supply |
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