W25Q128JVSIQ Winbond IC FLASH 128M SPI 133MHZ 8SOIC

label:

2024/01/4 462

• New Family of SpiFlash Memories
– W25Q128JV: 128M-bit / 16M-byte
– Standard SPI: CLK, /CS, DI, DO
– Dual SPI: CLK, /CS, IO0, IO1
– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
– Software & Hardware Reset(1)

• Highest Performance Serial Flash
– 133MHz Single, Dual/Quad SPI clocks
– 266/532MHz equivalent Dual/Quad SPI
– 66MB/S continuous data transfer rate
– Min. 100K Program-Erase cycles per sector
– More than 20-year data retention

• Efficient “Continuous Read”
– Continuous Read with 8/16/32/64-Byte Wrap
– As few as 8 clocks to address memory
– Allows true XIP (execute in place) operation

• Low Power, Wide Temperature Range
– Single 2.7 to 3.6V supply
– <1µA Power-down (typ.)
– -40°C to +85°C operating range
– -40°C to +105°C operating range

• Flexible Architecture with 4KB sectors
– Uniform Sector/Block Erase (4K/32K/64K-Byte)
– Program 1 to 256 byte per programmable page
– Erase/Program Suspend & Resume

• Advanced Security Features
– Software and Hardware Write-Protect
– Power Supply Lock-Down – Special OTP protection
– Top/Bottom, Complement array protection
– Individual Block/Sector array protection
– 64-Bit Unique ID for each device
– Discoverable Parameters (SFDP) Register
– 3X256-Bytes Security Registers with OTP locks
– Volatile & Non-volatile Status Register Bits

• Space Efficient Packaging
– 8-pin SOIC 208-mil
– 16-pin SOIC 300-mil (additional /RESET pin)
– 8-pad WSON 6x5-mm / 8x6-mm
– 24-ball TFBGA 8x6-mm (6x4/5x5 ball array)
– 24-ball WLCSP
– Contact Winbond for KGD and other options

CATALOG

W25Q128JVSIQ COUNTRY OF ORIGIN

W25Q128JVSIQ PARAMETRIC INFO

W25Q128JVSIQ PACKAGE INFO

W25Q128JVSIQ MANUFACTURING INFO

W25Q128JVSIQ PACKAGING INFO

W25Q128JVSIQ ECAD MODELS

COUNTRY OF ORIGIN

Taiwan (Province of China)

China

PARAMETRIC INFO

Density (bit)	128M
Cell Type	NOR
Interface Type	Serial (SPI, Dual SPI, Quad SPI)
Block Organization	Symmetrical
Boot Block	No
Timing Type	Synchronous
Architecture	Sectored
Maximum Access Time (ns)	6
Typical Operating Supply Voltage (V)	3\|3.3
Programmability	Yes
Tradename	SpiFlash
I/O Mode	Serial
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	85
Supplier Temperature Grade	Industrial
Number of Bits per Word (bit)	8
Number of Words	16M
Maximum Operating Current (mA)	25
Programming Voltage (V)	2.7 to 3.6
Maximum Operating Frequency (MHz)	532
Sector Size	4Kbyte x 4096
Program Current (mA)	25
Address Bus Width (bit)	24
Minimum Operating Supply Voltage (V)	2.7
Maximum Operating Supply Voltage (V)	3.6
Maximum Erase Time (s)	200/Chip
Maximum Programming Time (ms)	3/Page
Command Compatible	Yes
ECC Support	No
Erase Suspend/Resume Modes Support	Yes
Simultaneous Read/Write Support	No
Support of Common Flash Interface	No
Support of Page Mode	No
Page Size	256byte
Minimum Endurance (Cycles)	100000
Minimum Storage Temperature (°C)	-65
Maximum Storage Temperature (°C)	150
Density in Bits (bit)	134217728
Process Technology	58nm

PACKAGE INFO

Supplier Package	SOIC
Basic Package Type	Lead-Frame SMT
Pin Count	8
Lead Shape	Gull-wing
PCB	8
Tab	N/R
Pin Pitch (mm)	1.27
Package Length (mm)	5.28
Package Width (mm)	5.28
Package Height (mm)	1.8
Package Diameter (mm)	N/R
Package Overall Length (mm)	5.28
Package Overall Width (mm)	7.9
Package Overall Height (mm)	1.95
Seated Plane Height (mm)	1.95
Mounting	Surface Mount
Package Weight (g)	N/A
Package Material	Plastic
Package Description	Small Outline IC
Package Family Name	SO
Jedec	N/A

MANUFACTURING INFO

MSL	3
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	30
Number of Reflow Cycle	3
Standard	J-STD-020
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Wave Temp. Source	Link to Datasheet
Lead Finish(Plating)	Matte Sn annealed
Under Plating Material	N/A
Terminal Base Material	Cu Alloy
Number of Wave Cycles	N/R

PACKAGING INFO

Packaging	Tube
Packaging Document	Link to Datasheet

ECAD MODELS