W25Q16JVSNIQ TR Winbond IC FLASH 16MBIT SPI/QUAD 8SOIC

label:
2025/04/2 14
W25Q16JVSNIQ TR Winbond IC FLASH 16MBIT SPI/QUAD 8SOIC


CATALOG
W25Q16JVSNIQ TR COUNTRY OF ORIGIN
W25Q16JVSNIQ TR PARAMETRIC INFO
W25Q16JVSNIQ TR PACKAGE INFO
W25Q16JVSNIQ TR MANUFACTURING INFO
W25Q16JVSNIQ TR PACKAGING INFO


COUNTRY OF ORIGIN
China
Taiwan (Province of China)


PARAMETRIC INFO
Density (bit) 16M
Cell Type NOR
Interface Type Serial (SPI, Dual SPI, Quad SPI)
Block Organization Symmetrical
Boot Block Yes
Timing Type Synchronous
Architecture Sectored
Maximum Access Time (ns) 6
Programmability Yes
Typical Operating Supply Voltage (V) 3|3.3
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Number of Bits per Word (bit) 8
Number of Words 2M
Location of Boot Block Bottom|Top
Maximum Operating Current (mA) 25
Programming Voltage (V) 2.7 to 3.6
Sector Size 4Kbyte x 512
Program Current (mA) 25
Address Width (bit) 24
Minimum Operating Supply Voltage (V) 2.7
Maximum Operating Supply Voltage (V) 3.6
Maximum Erase Time (s) 25/Chip
Maximum Programming Time (ms) 3/Page
Command Compatible Yes
ECC Support No
Erase Suspend/Resume Modes Support Yes
Simultaneous Read/Write Support No
Support of Common Flash Interface No
Support of Page Mode No
Page Size 256byte
Minimum Endurance (Cycles) 100000
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Density in Bits (bit) 16777216


PACKAGE INFO
Supplier Package SOIC N
Pin Count 8
PCB 8
Tab N/R
Package Length (mm) 4.85
Package Width (mm) 3.9
Package Height (mm) 1.45
Package Diameter (mm) N/R
Mounting Surface Mount
Package Weight (g) N/A
Package Family Name SO
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Lead Finish(Plating) Matte Sn
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Suffix TR
Packaging Tape and Reel
Packaging Document Link to Datasheet


Продукт RFQ