W25Q16JVSNIQ Winbond IC FLASH 16M SPI 133MHZ 8SOIC

label:
2024/12/20 114
W25Q16JVSNIQ Winbond IC FLASH 16M SPI 133MHZ 8SOIC


CATALOG
W25Q16JVSNIQ COUNTRY OF ORIGIN
W25Q16JVSNIQ PARAMETRIC INFO
W25Q16JVSNIQ PACKAGE INFO
W25Q16JVSNIQ MANUFACTURING INFO
W25Q16JVSNIQ PACKAGING INFO
W25Q16JVSNIQ ECAD MODELS


COUNTRY OF ORIGIN
China
Taiwan (Province of China)


PARAMETRIC INFO
Density (bit) 16M
Cell Type NOR
Interface Type Serial (SPI, Dual SPI, Quad SPI)
Block Organization Symmetrical
Boot Block No
Timing Type Synchronous
Architecture Sectored
Maximum Access Time (ns) 6
Programmability Yes
Typical Operating Supply Voltage (V) 3|3.3
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Number of Bits per Word (bit) 8
Number of Words 2M
Maximum Operating Current (mA) 25
Programming Voltage (V) 2.7 to 3.6
Maximum Operating Frequency (MHz) 133
Sector Size 4Kbyte x 512
Program Current (mA) 25
Address Width (bit) 24
Minimum Operating Supply Voltage (V) 2.7
Maximum Operating Supply Voltage (V) 3.6
Maximum Erase Time (s) 25/Chip
Maximum Programming Time (ms) 3/Page
Command Compatible Yes
ECC Support No
Erase Suspend/Resume Modes Support Yes
Simultaneous Read/Write Support No
Support of Common Flash Interface No
Support of Page Mode No
Page Size 256byte
Minimum Endurance (Cycles) 100000
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Density in Bits (bit) 16777216


PACKAGE INFO
Supplier Package SOIC N
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 4.85
Package Width (mm) 3.9
Package Height (mm) 1.45
Package Diameter (mm) N/R
Seated Plane Height (mm) 1.6
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline IC Narrow Body
Package Family Name SO
Jedec MS-012AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 20 to 40
Number of Reflow Cycle 3
Standard J-STD-020C
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/R
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Tube
Packaging Document Link to Datasheet


ECAD MODELS


Продукт RFQ