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CATALOG |
WM8731SEDS/RV LIFECYCLE |
WM8731SEDS/RV PARAMETRIC INFO
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WM8731SEDS/RV PACKAGE INFO
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WM8731SEDS/RV MANUFACTURING INFO
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WM8731SEDS/RV PACKAGING INFO
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WM8731SEDS/RV ECAD MODELS
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WM8731SEDS/RV BLOCK DIAGRAM
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LIFECYCLE |
Obsolete
Sep 21,2022 |
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PARAMETRIC INFO
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Type |
PCM |
Number of ADCs |
2 |
Number of DACs |
2 |
Interface Type |
Serial (2-Wire, 3-Wire, I2S) |
Sampling Rate (ksps) |
48 |
Number of Channels |
2ADC / 2DAC |
Number of ADC Inputs |
2 |
Number of DAC Outputs |
2 |
Signal to Noise Ratio (dB) |
95 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Maximum Storage Temperature (°C) |
150 |
Minimum Storage Temperature (°C) |
-65 |
Power Supply Type |
Analog|Digital |
Process Technology |
CMOS |
Typical Operating Supply Voltage (V) |
3.3 |
Operating Supply Voltage (V) |
3.3 |
Minimum Operating Supply Voltage (V) |
2.7 |
Maximum Operating Supply Voltage (V) |
3.6 |
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PACKAGE INFO
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Supplier Package |
SSOP |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
28 |
Lead Shape |
Gull-wing |
PCB |
28 |
Tab |
N/R |
Pin Pitch (mm) |
0.65 |
Package Length (mm) |
10.2 |
Package Width (mm) |
5.3 |
Package Height (mm) |
1.75(Max) |
Package Diameter (mm) |
N/R |
Seated Plane Height (mm) |
2(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Shrink Small Outline Package |
Package Family Name |
SO |
Jedec |
MO-150AH |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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MSL |
3 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
20 |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
260 |
Wave Solder Time (Sec) |
5 |
Wave Temp. Source |
Link to Datasheet |
Lead Finish(Plating) |
Matte Sn |
Under Plating Material |
N/A |
Terminal Base Material |
N/A |
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PACKAGING INFO
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Packaging Suffix |
R |
Packaging |
Tape and Reel |
Quantity Of Packaging |
2000 |
Packaging Document |
Link to Datasheet |
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ECAD MODELS
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BLOCK DIAGRAM |

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