XC7Z020-2CLG400I Xilinx IC SOC CORTEX-A9 ARTIX-7 400BGA

label:
2023/12/11 370




CATALOG
XC7Z020-2CLG400I COUNTRY OF ORIGIN
XC7Z020-2CLG400I PARAMETRIC INFO
XC7Z020-2CLG400I PACKAGE INFO
XC7Z020-2CLG400I MANUFACTURING INFO
XC7Z020-2CLG400I ECAD MODELS


COUNTRY OF ORIGIN
Korea (Republic of)
Taiwan (Province of China)


PARAMETRIC INFO
Device Logic Units 85000
Device Logic Cells 85000
Maximum Number of User I/Os 128
Number of I/O Banks 4
Device Number of DLLs/PLLs 4
Number of Multipliers 220 (18x25)
Number of Regional Clocks 4
Tradename Zynq®
Number of Registers 106400
RAM Bits (Kbit) 560
Total Number of Block RAM 140
Program Memory Type SRAM
Family Name Zynq®-7000
Process Technology 28nm
Speed Grade 2
Dedicated DSP 220
Differential I/O Standards Supported LVDS|SSTL|HSTL
Ethernet MACs 2
Copy Protection Yes
Shift Registers Utilize LUT
Programmability Yes
In-System Programmability Yes
Reprogrammability Support No
Number of Global Clocks 32
Maximum Operating Supply Voltage (V) 1.05
I/O Voltage (V) 1.2|1.35|1.5|1.8|2.5|3.3
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 100
Temperature Flag Opr
Supplier Temperature Grade Industrial
Digital Control Impedance No
Minimum Operating Supply Voltage (V) 0.95
Typical Operating Supply Voltage (V) 1
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package CSBGA
Basic Package Type Ball Grid Array
Pin Count 400
Lead Shape Ball
PCB 400
Tab N/R
Pin Pitch (mm) 0.8
Package Length (mm) 17
Package Width (mm) 17
Package Height (mm) 1.07
Package Diameter (mm) N/R
Seated Plane Height (mm) 1.47
Mounting Surface Mount
Package Material Plastic
Package Description Chip Scale Ball Grid Array
Package Family Name BGA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) SnAgCu
Under Plating Material N/A
Terminal Base Material N/R


ECAD MODELS


Продукт RFQ