STMicroelectronics Expands STM32 MPU Lineup with High-Performance, Industrial-Grade STM32MP23 Series

STMicroelectronics has announced the volume production of its new STM32MP23 general-purpose microprocessors (MPUs), delivering a powerful blend of performance, energy efficiency, and ruggedness. Designed for industrial and IoT edge computing, the STM32MP23 supports advanced HMI and machine learning workloads, operating reliably at temperatures up to 125°C.

Following the release of the STM32MP25 series in 2024, the STM32MP23 integrates dual 1.5GHz Arm® Cortex®-A35 cores, a 400MHz Cortex®-M33 core for real-time processing, and a neural network accelerator delivering up to 0.6 TOPS. The MPU also features a 3D GPU, H.264 video decoder, MIPI CSI-2 camera interface for raw data, dual Gigabit Ethernet with TSN support, and two CAN-FD interfaces, making it ideal for intelligent, connected systems.

Engineered for applications in smart factories, cities, and homes, the STM32MP23 blends powerful processing with optimized on-chip resources. Its neural engine enables local AI/ML capabilities, supporting intuitive HMI, computer vision, and predictive maintenance. The integrated H.264 decoder handles up to 1080p60 video, while the 3D GPU supports real-time graphics using open frameworks like OpenGL, OpenCL, and Vulkan.

To meet the rising demand for secure, connected devices, the STM32MP23 is designed for SESIP3 and PSA Level 3 certifications (already achieved by STM32MP25). Security features include secure boot, Arm TrustZone™, tamper detection, secure key storage, and hardware crypto acceleration.

Coinciding with this launch, ST has extended OpenSTLinux long-term support from 2 years to 5 years per release, offering customers greater stability, timely access to security patches, and simplified compliance with the EU Cyber Resilience Act (CRA). ST continues to promote OpenSTLinux as a mainstream platform, enabling developers to build on popular frameworks such as Yocto, Buildroot, OpenWRT, and OpenSTDroid, accelerating time to market.

For rapid evaluation and development, the STM32MP257 Discovery Kit supports STM32MP23x configurations. Developers are encouraged to follow the comprehensive guidance available in ST’s latest wiki documentation to maximize the kit’s potential.

The series is offered in three BGA package options, featuring either high-density 0.5mm or standard 0.8mm interconnect pitch for simplified 4-layer PCB design with plated through-holes. All packages maintain pin compatibility with the STM32MP25 series. Operating across an extended industrial temperature range (-40°C to +125°C junction), the STM32MP23 is built for reliable deployment in demanding environments.